Enhanced Cu-to-Cu direct bonding by controlling surface physical properties
Chiang, Po-Hao, Liang, Sin-Yong, Song, Jenn-Ming, Huang, Shang-Kun, Chiu, Ying-Ta, Hung, Chih-Pin
Published in Japanese Journal of Applied Physics (01.03.2017)
Published in Japanese Journal of Applied Physics (01.03.2017)
Get full text
Journal Article
Direct bonding for dissimilar metals assisted by carboxylic acid vapor
Song, Jenn-Ming, Huang, Shang-Kun, Akaike, Masatake, Suga, Tadatomo
Published in Japanese Journal of Applied Physics (01.03.2015)
Published in Japanese Journal of Applied Physics (01.03.2015)
Get full text
Journal Article
Stress-enhanced Cu-to-Cu Bonding for MEMS Packaging
Song, Jenn-Ming, Liang, Sin-Yong, Xie, Zong-Yu, Chiang, Po-Hao, Huang, Shang-Kun, Chiu, Ying-Ta, Tarng, David, Hung, Chih-Pin, Lin, Jing-Yuan
Published in Sensors and materials (01.01.2018)
Published in Sensors and materials (01.01.2018)
Get full text
Journal Article
Development of Novel Fine Line 2.1 D Package with Organic Interposer Using Advanced Substrate-Based Process
Wei-Chung Chen, Chiu-Wen Lee, Hung-Chun Kuo, Min-Hua Chung, Chaung-Chi Wang, Shang-Kun Huang, Yen-Sen Liao, Chen-Chao Wang, Tarng, David
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Get full text
Conference Proceeding
Novel ultra-fine line 2.1D package with organic interposer
Wei-Chung Chen, Chiu-Wen Lee, Min-Hua Chung, Chuang-Chi Wang, Shang-Kun Huang, Yen-Sen Liao
Published in 2017 IEEE CPMT Symposium Japan (ICSJ) (01.11.2017)
Published in 2017 IEEE CPMT Symposium Japan (ICSJ) (01.11.2017)
Get full text
Conference Proceeding
Direct metallic bonding assisted by electromagnetic irradiations
Yu, Yi-You, Liang, Sin-Yong, Song, Jenn-Ming, Huang, Shang-Kun, Chiu, Ying-Ta, Tarng, David, Hung, Chih-Pin
Published in 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) (01.04.2018)
Published in 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) (01.04.2018)
Get full text
Conference Proceeding
Effects of electromagnetic radiation exposure on direct Cu bonding
Song, Jenn-Ming, Liang, Sin-Yong, Chiang, Po-Hao, Huang, Shang-Kun, Chiu, Ying-Ta, Tarng, David, Hung, Chih-Pin
Published in 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) (01.05.2017)
Published in 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) (01.05.2017)
Get full text
Conference Proceeding
Low temperature direct Cu bonding for MEMS packaging
Jenn-Ming Song, Sin-Yong Liang, Po-Hao Chiang, Shang-Kun Huang, Ying-Ta Chiu, Tarng, David, Chih-Pin Hung, Jing-Yuan Lin
Published in 2017 International Conference on Electronics Packaging (ICEP) (01.04.2017)
Published in 2017 International Conference on Electronics Packaging (ICEP) (01.04.2017)
Get full text
Conference Proceeding
Low temperature direct Cu bonding assisted by residual stress
Sin-Yong Liang, Po-Hao Chiang, Zong-Yu Xie, Jenn-Ming Song, Shang-Kun Huang, Ying-Ta Chiu, Tarng, David, Chih-Pin Hung
Published in 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) (01.05.2017)
Published in 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) (01.05.2017)
Get full text
Conference Proceeding
SEMICONDUCTOR PACKAGES
HUANG, Shang-Kun, HUNG, Chih-Pin, WANG, Shiu-Chih, TARNG, Shin-Luh, CHIU, Ying-Ta, CHIU, Yong-Da
Year of Publication 08.08.2019
Get full text
Year of Publication 08.08.2019
Patent
SEMICONDUCTOR PACKAGES
CHIU, YONG-DA, HUANG, SHANG-KUN, WANG, SHIUIH, HUNG, CHIH-PIN, CHIU, YING-TA, TARNG, SHIN-LUH
Year of Publication 13.08.2019
Get full text
Year of Publication 13.08.2019
Patent