Data-driven electronic packaging structure inverse design with an adaptive surrogate model
Liu, Shaoyi, Song, Xue, Lian, Peiyuan, Huang, Jianlun, Wang, Zhihai, Lihao Ping, Wang, Congsi
Published in Soldering & surface mount technology (13.11.2023)
Published in Soldering & surface mount technology (13.11.2023)
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Journal Article
2.5D Chip-Package Warpage Analysis Using RVE-Based Homogenization Method
Huang, Jianlun, Xue, Song, Liu, Shaoyi, Li, Guangmi, Wang, Congsi
Published in 2024 25th International Conference on Electronic Packaging Technology (ICEPT) (07.08.2024)
Published in 2024 25th International Conference on Electronic Packaging Technology (ICEPT) (07.08.2024)
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Conference Proceeding
Liquid microwave heating sterilization device
LI WEINAN, LI SHAOHUI, HUANG ZICHENG, HUANG JIANLUN, ZHAO LEI, LI SHAOJUN
Year of Publication 27.10.2023
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Year of Publication 27.10.2023
Patent
Rectangular waveguide assembly
LI WEINAN, LI SHAOHUI, HUANG JIANLUN, ZHAO LEI, PAN QIHUA, LI SHAOJUN
Year of Publication 29.09.2023
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Year of Publication 29.09.2023
Patent
Pipeline type crude oil microwave radiation demulsification device
LI WEINAN, LI SHAOHUI, WANG RUIKAI, HUANG JIANLUN, ZHAO LEI, LI SHAOJUN
Year of Publication 24.01.2023
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Year of Publication 24.01.2023
Patent
Microwave aging accelerating device for distilled and fermented wine
LI WEINAN, ZONG DEJING, LI SHAOHUI, GUO XIAOBO, HUANG JIANLUN, PAN QIHUA, ZHANG YONGJIE, LI SHAOJUN
Year of Publication 21.11.2023
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Year of Publication 21.11.2023
Patent