Study on Induction Heating Coil for Uniform Mold Cavity Surface Heating
Sung, Yu-Ting, Hwang, Sheng-Jye, Lee, Huei-Huang, Huang, Durn-Yuan
Published in Advances in Mechanical Engineering (01.01.2014)
Published in Advances in Mechanical Engineering (01.01.2014)
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Journal Article
Prediction of paddle shift via 3-D TSOP modeling
Su, F., Sheng-Jye Hwang, Huei-Huang Lee, Durn-Yuan Huang
Published in IEEE transactions on components and packaging technologies (01.12.2000)
Published in IEEE transactions on components and packaging technologies (01.12.2000)
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Journal Article
Simulation of warpage considering both thermal and cure induced shrinkage during molding in IC packaging
HONG, Li-Ching, HWANG, Sheng-Jye, LEE, Huei-Huang, HUANG, Durn-Yuan
Published in 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004 (2004)
Published in 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004 (2004)
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Conference Proceeding
On mold corner effects of EMC adhesion for IC encapsulation process
Chia-Hsun Yeh, Chen-hung Deng, Huei-Huang Lee, Sheng-Jye Hwang, Durn-Yuan Huang
Published in 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2011)
Published in 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2011)
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Conference Proceeding
Warpage simulations with P-V-T-C equation and experiments of fan-out wafer level package after encapsulation process
Shang-Shiuan Deng, Sheng-Jye Hwang, Huei-Huang Lee, Durn-Yuan Huang, Geng-Shin Shen
Published in 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference (01.10.2010)
Published in 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference (01.10.2010)
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Conference Proceeding
Simulation and experiments of fan-out wafer level package during encapsulation
Shang-Shiuan Deng, Sheng-Jye Hwang, Huei-Huang Lee, Durn-Yuan Huang, Yu-Ren Chen, Geng-Shin Shen
Published in 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (01.10.2009)
Published in 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (01.10.2009)
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Conference Proceeding
Design and Development of Oral Appliance for Obstructive Sleep Apnea
Lee, Huei Huang, Chang, Yi San, Lai, Yu Bin, Huang, Durn Yuan, Hwang, Sheng Jye
Published in Applied Mechanics and Materials (25.01.2013)
Published in Applied Mechanics and Materials (25.01.2013)
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Journal Article
Prediction of Process Induced Warpage of Electronic Package by P-V-T-C Equation and Taguchi Method
Jian-Yu Chen, Shiang-Yu Teng, Sheng-Jye Hwang, Huei-Huang Lee, Durn-Yuan Huang
Published in 2006 International Conference on Electronic Materials and Packaging (01.12.2006)
Published in 2006 International Conference on Electronic Materials and Packaging (01.12.2006)
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Conference Proceeding
Heating system
Lee, Huei-Huang, Hwang, Sheng-Jye, Lin, Yu-Hsien, Chang, Yi-San, Bui, Huy-Tien, Huang, Durn-Yuan, Lin, Xi-Zhang
Year of Publication 03.09.2019
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Year of Publication 03.09.2019
Patent
HEATING SYSTEM
Lin Xi-Zhang, Lee Huei-Huang, Hwang Sheng-Jye, Huang Durn-Yuan, Chang Yi-San, Bui Huy-Tien, Lin Yu-Hsien
Year of Publication 07.12.2017
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Year of Publication 07.12.2017
Patent
Heating system
LIN, XI-ZHANG, LIN, YU-HSIEN, HWANG, SHENG-JYE, BUI, HUY-TIEN, CHANG, YI-SAN, LEE, HUEI-HUANG, HUANG, DURN-YUAN
Year of Publication 11.12.2018
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Year of Publication 11.12.2018
Patent
Post-mold cure process simulation of IC packaging
Chi-Hong Shue, Sheng-Jye Hwang, Huei-Huang Lee, Durn-Yuan Huang, Yao-Jung Lee
Published in 2008 International Conference on Electronic Materials and Packaging (01.10.2008)
Published in 2008 International Conference on Electronic Materials and Packaging (01.10.2008)
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Conference Proceeding
Heating system
HUANG DURN-YUAN, LIN XI-ZHANG, LEE HUEI-HUANG, LIN YU-HSIEN, BUI HUY-TIEN, HWANG SHENG-JYE, CHANG YI-SAN
Year of Publication 01.08.2017
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Year of Publication 01.08.2017
Patent
TWI505844B
CHANG, YI SAN, HUANG, DURN YUAN, LEE, HUEI HUANG, LAI, YU BIN, HWANG, SHENG JYE
Year of Publication 01.11.2015
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Year of Publication 01.11.2015
Patent
TWI505843B
CHANG, YI SAN, HUANG, DURN YUAN, LEE, HUEI HUANG, LAI, YU BIN, HWANG, SHENG JYE
Year of Publication 01.11.2015
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Year of Publication 01.11.2015
Patent
HEATING SYSTEM
LIN, XI-ZHANG, LIN, YU-HSIEN, HWANG, SHENG-JYE, BUI, HUY-TIEN, CHANG, YI-SAN, LEE, HUEI-HUANG, HUANG, DURN-YUAN
Year of Publication 07.07.2016
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Year of Publication 07.07.2016
Patent