A Broadband Passive Monopulse Comparator MMIC
Chen, Yang, Xu, Yuehang, Hu, Liulin, Tong, Wei, Xu, Ruimin
Published in IEEE microwave and wireless components letters (01.04.2017)
Published in IEEE microwave and wireless components letters (01.04.2017)
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Journal Article
A RF Redundant TSV Interconnection for High Resistance Si Interposer
Wang, Mengcheng, Ma, Shenglin, Jin, Yufeng, Wang, Wei, Chen, Jing, Hu, Liulin, He, Shuwei
Published in Micromachines (Basel) (08.02.2021)
Published in Micromachines (Basel) (08.02.2021)
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Journal Article
A Wideband High-Efficiency GaN MMIC Power Amplifier for Sub-6-GHz Applications
Hu, Liulin, Liao, Xuejie, Zhang, Fan, Wu, Haifeng, Ma, Shenglin, Lin, Qian, Tang, Xiaohong
Published in Micromachines (Basel) (20.05.2022)
Published in Micromachines (Basel) (20.05.2022)
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Journal Article
A 2 to 18 GHz Compact High-Gain and High-Power GaN Amplifier
Haifeng Wu, Qian Lin, Lin Zhu, Shanji Chen, Yijun Chen, Liulin Hu
Published in 2019 IEEE MTT-S International Microwave Symposium (IMS) (01.06.2019)
Published in 2019 IEEE MTT-S International Microwave Symposium (IMS) (01.06.2019)
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Conference Proceeding
A 4-10 GHz fully-integrated stacked GaAs pHEMT power amplifier
Haifeng Wu, Xuejie Liao, Cetian Wang, Yijun Chen, Yunan Hua, Liulin Hu, Jiping Lv, Wei Tong
Published in 2017 IEEE MTT-S International Microwave Symposium (IMS) (01.06.2017)
Published in 2017 IEEE MTT-S International Microwave Symposium (IMS) (01.06.2017)
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Conference Proceeding
Thermal and Electrical Characterization of TSV Interposer Embedded with Microchannel for 2.5D Integration of GaN RF Devices
Han Cai, Shenglin Ma, Wei Wang, Yufeng Jin, Jing Chen, Jian Zhang, Weiwei Xiang, Liulin Hu, Shuwei He
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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Conference Proceeding
An Ultra-Broadband Quadruple-Stacked CMOS Power Amplifier
Lin, Qian, Wu, Haifeng, Zhang, Xiao-Ming, Hu, Liulin, Chen, Si-Wei, Hu, Dan-Hui
Published in 2019 Cross Strait Quad-Regional Radio Science and Wireless Technology Conference (CSQRWC) (01.07.2019)
Published in 2019 Cross Strait Quad-Regional Radio Science and Wireless Technology Conference (CSQRWC) (01.07.2019)
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Conference Proceeding
Design, Fabrication and Characterization of TSV Interposer Integrated 3D Capacitor for SIP Applications
Jiwei Li, Shenglin Ma, Huan Liu, Yong Guan, Jing Chen, Yufeng Jin, Wei Wang, Liulin Hu, Shuwei He
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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Conference Proceeding
Design, Fabrication and Characterization of a Novel TSV Interposer Integrated Inductor for RF Applications
Yunheng Sun, Yufeng Jin, Wei Wang, Jing Chen, Han Cai, Jiwei Li, Shenglin Ma, Liulin Hu, Shuwei He, Min Miao
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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Conference Proceeding
Design, fabrication, and radio frequency property evaluation of a through-glass-via interposer for 2.5D radio frequency integration
Cai, Han, Yan, Jun, Ma, Shenglin, Luo, Rongfeng, Xia, Yanming, Li, Jiwei, Hu, Liulin, He, Shuwei, Tang, Zhongjun, Jin, Yufeng, Wang, Wei, Chen, Jing
Published in Journal of micromechanics and microengineering (01.07.2019)
Published in Journal of micromechanics and microengineering (01.07.2019)
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Journal Article
A Compact Ultra-broadband GaN MMIC T/R Front-End Module
Lin, Qian, Wu, Haifeng, Chen, Yijun, Hu, Liulin, Chen, Shanji, Zhang, Xiaoming
Published in 2020 IEEE/MTT-S International Microwave Symposium (IMS) (01.08.2020)
Published in 2020 IEEE/MTT-S International Microwave Symposium (IMS) (01.08.2020)
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Conference Proceeding
Study of 3D SiP (system-in-package) module for package-on-package application using multi-layer PCB manufacturing process
Liulin Hu, Zhu Jin, Xuejie Liao, Yaoguo Ouyang, Jinsheng Dong
Published in 2014 15th International Conference on Electronic Packaging Technology (01.05.2014)
Published in 2014 15th International Conference on Electronic Packaging Technology (01.05.2014)
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Conference Proceeding
Thermal Property Evaluation of TSV interposer Embedded Microfluidics for Cooling 2.5D Integrated High Power IC Device
Ma, Shenglin, Lian, Tingting, Cai, Han, Hu, Liulin, He, Shuwei
Published in 2019 20th International Conference on Electronic Packaging Technology(ICEPT) (01.08.2019)
Published in 2019 20th International Conference on Electronic Packaging Technology(ICEPT) (01.08.2019)
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Conference Proceeding
Design and Process Technology for High Q Integrated Inductor on Interposer with TSV
Hu, LiuLin, He, ShuWei, Sun, Yunheng, Ma, Shenglin
Published in 2018 International Conference on Microwave and Millimeter Wave Technology (ICMMT) (01.05.2018)
Published in 2018 International Conference on Microwave and Millimeter Wave Technology (ICMMT) (01.05.2018)
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Conference Proceeding
A Ka band multifunction MMIC
Chen, Yijun, Tong, Wei, Lv, Jiping, Hu, Liulin, Su, Li
Published in 2019 International Conference on Microwave and Millimeter Wave Technology (ICMMT) (01.05.2019)
Published in 2019 International Conference on Microwave and Millimeter Wave Technology (ICMMT) (01.05.2019)
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Conference Proceeding
Design, fabrication and characterization of a Q-band patch antenna integrated on stacked interposers
Sun, Yunheng, Jin, Yufeng, Lian, Tingting, Ma, Shenglin, Yang, Yuchi, Wang, Wei, Hu, Liulin, He, Shuwei
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
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Conference Proceeding
Design, Fabrication and Measurement of Micro-Bumps Array for RF Application
Yang, Yuchi, Chen, Jing, Wang, Wei, Wang, Mengcheng, Ma, Shenglin, Hu, Liulin, He, Shuwei
Published in 2020 21st International Conference on Electronic Packaging Technology (ICEPT) (01.08.2020)
Published in 2020 21st International Conference on Electronic Packaging Technology (ICEPT) (01.08.2020)
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Conference Proceeding
Design and Experimentally Verification of a Vertical Coaxial Transmission Structure in High resistivity Si Interposer
Wang, MengCheng, Ma, Shenglin, He, ShuWei, Hu, Liulin, Wang, Wei, Jin, Yufeng
Published in 2020 21st International Conference on Electronic Packaging Technology (ICEPT) (01.08.2020)
Published in 2020 21st International Conference on Electronic Packaging Technology (ICEPT) (01.08.2020)
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Conference Proceeding
A High-Efficiency 3-Watt GaAs pHEMT X-Band MMIC Power Amplifier
Hua, Yunan, Wu, Haifeng, Liao, Xuejie, Liao, Chengjv, Hu, Liulin, Lv, Jiping
Published in 2018 International Conference on Microwave and Millimeter Wave Technology (ICMMT) (01.05.2018)
Published in 2018 International Conference on Microwave and Millimeter Wave Technology (ICMMT) (01.05.2018)
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Conference Proceeding