Direct Copper Plating on Ultra-Thin Sputtered Cobalt Film in an Alkaline Bath
Xu, Wen-Zhong, Xu, Jing-Bo, Lu, Hai-Sheng, Wang, Jing-Xuan, Hu, Zheng-Jun, Qu, Xin-Ping
Published in Journal of the Electrochemical Society (01.01.2013)
Published in Journal of the Electrochemical Society (01.01.2013)
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Journal Article
Sirt6 attenuates chondrocyte senescence and osteoarthritis progression
Ji, Ming-liang, Jiang, Hua, Li, Zhuang, Geng, Rui, Hu, Jun Zheng, Lin, Yu Cheng, Lu, Jun
Published in Nature communications (10.12.2022)
Published in Nature communications (10.12.2022)
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Journal Article
Effect of thickness scaling on the permeability and thermal stability of Ta(N) diffusion barrier
Xu, Haoyu, Hu, Zheng-Jun, Qu, Xin-Ping, Wan, Hao, Yan, Shen-Suo, Li, Ming, Chen, Shou-Mian, Zhao, Yu-Hang, Zhang, Jing, Baklanov, Mikhail R.
Published in Applied surface science (31.12.2019)
Published in Applied surface science (31.12.2019)
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Journal Article
Circulating Klotho is linked to prognosis of acute intracerebral hemorrhage
Hu, Zheng-Jun, Wang, Xiao-Chun, Zhu, Lin-Chao, Yao, Yi-Min, Chen, Ting-Ting, Xu, Jian, Lu, Ru-Feng
Published in Clinica chimica acta (01.10.2019)
Published in Clinica chimica acta (01.10.2019)
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Journal Article
Cu CMP process development and characterization of Cu dishing with 1.8 μm Cu pad and 3.6 μm pitch in Cu/SiO2 hybrid bonding
Hu, Zheng-Jun, Qu, Xin-Ping, Lin, Hong, Huang, Ren-Dong, Ge, Xing-Chen, Li, Ming, Chen, Shou-Mian, Zhao, Yu-Hang
Published in Japanese Journal of Applied Physics (01.07.2019)
Published in Japanese Journal of Applied Physics (01.07.2019)
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Journal Article
Voidless metal filling and elimination of metal diffusion in PVD barrier and seed process for high performance Cu interconnect
Hu, Zheng-Jun, Qu, Xin-Ping, Lin, Hong, Zuo, Qing-Yun, Wang, Wei-Jun, Li, Ming, Chen, Shou-Mian, Zhao, Yu-Hang
Published in 2018 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT) (01.10.2018)
Published in 2018 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT) (01.10.2018)
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Conference Proceeding
Optimization of microwave pretreatment of lignocellulosic waste for enhancing methane production： Hyacinth as an example
Zhao, Bai-Hang, Chen, Jie, Yu, Han-Qing, Hu, Zhen-Hu, Yue, Zheng-Bo, Li, Jun
Published in Frontiers of environmental science & engineering (01.12.2017)
Published in Frontiers of environmental science & engineering (01.12.2017)
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Journal Article
Cu CMP process development and characterization of Cu dishing with 1.8 μ m Cu pad and 3.6 μ m pitch in Cu/SiO 2 hybrid bonding
Hu, Zheng-Jun, Qu, Xin-Ping, Lin, Hong, Huang, Ren-Dong, Ge, Xing-Chen, Li, Ming, Chen, Shou-Mian, Zhao, Yu-Hang
Published in Japanese Journal of Applied Physics (01.07.2019)
Published in Japanese Journal of Applied Physics (01.07.2019)
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Journal Article
Cu CMP process development and characterization of Cu dishing with 1.8 m Cu pad and 3.6 m pitch in Cu/SiO2 hybrid bonding
Hu, Zheng-Jun, Qu, Xin-Ping, Lin, Hong, Huang, Ren-Dong, Ge, Xing-Chen, Li, Ming, Chen, Shou-Mian, Zhao, Yu-Hang
Published in Japanese Journal of Applied Physics (26.06.2019)
Published in Japanese Journal of Applied Physics (26.06.2019)
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Journal Article
CU seed, CMP process development and via resistance extraction in through silicon via technology
Zheng-Jun Hu, Xin-Ping Qu, Hong Lin, Ren-Dong Huang, Qing-Yun Zuo, Ming Li, Shou-Mian Chen, Yu-Hang Zhao
Published in 2014 12th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT) (01.10.2014)
Published in 2014 12th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT) (01.10.2014)
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Conference Proceeding
Prokaryotic expression of human GITRaa27-165 and preparation of its polyclonal antibody
Tong, Jia, Wang, Sheng-jun, Chen, Jun, Mao, Chao-ming, Yang, Yun-liang, Yang, Min, Hu, Zheng-jun, Zhi, Di-yuan, Xu, Hua-Xi
Published in Xi bao yu fen zi mian yi xue za zhi (01.03.2008)
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Published in Xi bao yu fen zi mian yi xue za zhi (01.03.2008)
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