On-chip Cu interconnection using 1 to 5 nm thick metal cap
MALHOTRA SANDRA G, BRULEY JOHN, HU CHAO-KUN, GIGNAC LYNNE M, LINIGER ERIC G, ROSSNAGEL STEPHEN M, CARRUTHERS ROY A
Year of Publication 20.07.2006
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Year of Publication 20.07.2006
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REDUCED ELECTROMIGRATION AND STRESS INDUCED MIGRATION OF CU WIRES BY SURFACE COATING
HU, CHAO-KUN, SAMBUCETTI, CARLOS, J, STAMPER, ANTHONY, K, RUBINO, JUDITH, M, ROSENBERG, ROBERT
Year of Publication 05.06.2002
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Year of Publication 05.06.2002
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REDUCED ELECTROMIGRATION AND STRESS INDUCED MIGRATION OF Cu WIRES BY SURFACE COATING
HU, CHAO-KUN, SAMBUCETTI, CARLOS, J, STAMPER, ANTHONY, K, RUBINO, JUDITH, M, ROSENBERG, ROBERT
Year of Publication 01.02.2001
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Year of Publication 01.02.2001
Patent
Copper interconnection structure incorporating a metal seed layer
HU CHAO-KUN, SIMON ANDREW H, HARPER JAMES MCKELL EDWIN, EDELSTEIN DANIEL CHARLES, UZOH CYPRIAN EMEKA
Year of Publication 04.06.2002
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Year of Publication 04.06.2002
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Electroplated interconnection structures on integrated circuit chips
RODBELL KENNETH P, HORKANS WILMA JEAN, HU CHAO-KUN, HURD JEFFREY LOUIS, ANDRICACOS PANAYOTIS CONSTANTINOU, DUKOVIC JOHN OWEN, EDELSTEIN DANIEL C, WONG KWONG-HON, DELIGIANNI HARIKILIA, UZOH CYPRIAN EMEKA
Year of Publication 20.09.2005
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Year of Publication 20.09.2005
Patent
Copper interconnection structure incorporating a metal seed layer
HU CHAO-KUN, SIMON ANDREW H, HARPER JAMES MCKELL EDWIN, EDELSTEIN DANIEL CHARLES, UZOH CYPRIAN EMEKA
Year of Publication 30.01.2001
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Year of Publication 30.01.2001
Patent
Copper interconnection structure incorporating a metal seed layer
HU, CHAO-KUN, HARPER, JAMES MCKELL EDWIN, EDELSTEIN, DANIEL CHARLES, UZOH, CYPRIAN EMEKA, SIMON, ANDREW H
Year of Publication 11.01.2001
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Year of Publication 11.01.2001
Patent
ELECTROPLATED INTERCONNECTION STRUCTURE ON INTEGRATED CIRCUIT CHIP
HU CHAO-KUN, HURD JEFFREY LOUIS, ANDRICACOS PANAYOTIS CONSTANTINOU, DELIGIANNI HARIKLIA, RODBELL KENNETH PARKER, DUKOVIC JOHN OWEN, HORKANS WILMA J, WONG KWONG-HON, EDELSTEIN DANIEL CHARLES, UZOH CYPRIAN EMEKA
Year of Publication 26.05.2005
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Year of Publication 26.05.2005
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Interconnects with Ti-containing liners
CARRUTHERS ROY ARTHUR, LEE KIM YANG, SHAW THOMAS MCCARROLL, HU CHAO-KUN, NOYAN ISMAIL CEVDET, HARPER JAMES MCKELL EDWIN, ROSENBERG ROBERT, CABRAL, JR. CYRIL
Year of Publication 07.01.2003
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Year of Publication 07.01.2003
Patent
Electroplated interconnection structures on integrated circuit chips
HORKANS WILMA JEAN, HU CHAO-KUN, HURD JEFFREY LOUIS, ANDRICACOS PANAYOTIS CONSTANTINOU, DELIGIANNI HARIKLIA, RODBELL KENNETH PARKER, DUKOVIC JOHN OWEN, WONG KWONG-HON, EDELSTEIN DANIEL CHARLES, UZOH CYPRIAN EMEKA
Year of Publication 18.11.2004
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Year of Publication 18.11.2004
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Aluminum-based metallization exhibiting reduced electromigration and method therefor
GIGNAC LYNNE MARIE, HU CHAO-KUN, GAMBINO JEFFREY PETER, RODBELL KENNETH PARKER, IGGULDEN ROY CHARLES, WEBER STEFAN, SCHNABEL RAINER FLORIAN, FILIPPI RONALD GENE, CLEVENGER LAWRENCE ALFRED
Year of Publication 10.09.2002
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Year of Publication 10.09.2002
Patent
COPPER INTERCONNECTION OF METAL SEED LAYER INSERTION STRUCTURE
HU CHAO-KUN, SIMON ANDREW H, HARPER JAMES MCKELL EDWIN, EDELSTEIN DANIEL CHARLES, UZOH CYPRIAN EMEKA
Year of Publication 10.12.1999
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Year of Publication 10.12.1999
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