9 - Electromigration in Cu Thin Films
Hu, Chao-Kun, Gignac, Lynne M., Rosenberg, Robert
Published in Diffusion Processes in Advanced Technological Materials (2005)
Published in Diffusion Processes in Advanced Technological Materials (2005)
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Book Chapter
Structure and method of forming electrically blown metal fuses for integrated circuits
Bonilla, Griselda, Chanda, Kaushik, Filippi, Ronald G, Gambino, Jeffrey P, Grunow, Stephan, Hu, Chao-Kun, Sankaran, Sujatha, Simon, Andrew H, Standaert, Theodorus E
Year of Publication 15.06.2010
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Year of Publication 15.06.2010
Patent
Self-Assembly Based Air-Gap Integration
Ponoth, Shom, Horak, Dave, Nitta, Satya, Colburn, Matthew, Breyta, Greg, Huang, Elbert, Sucharitaves, Jeanne Tania, Landis, Howard, Lisi, Anthony, Liu, Xiao, Vo, Tuan, Johnson, Richard, Li, Wai-kin, Purushothaman, Sampath, Cohen, Stephan, Hu, Chao-Kun, Kim, Ho-Cheol, Clevenger, Larry, Fuller, Nicholas, Nogami, Takeshi, Spooner, Terry, Edelstein, Dan
Published in Meeting abstracts (Electrochemical Society) (29.08.2008)
Published in Meeting abstracts (Electrochemical Society) (29.08.2008)
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Journal Article
On-chip Cu interconnection using 1 to 5 nm thick metal cap
Bruley, John, Carruthers, Roy A, Gignac, Lynne Marie, Hu, Chao-Kun, Liniger, Eric Gerhard, Malhotra, Sandra Guy, Rossnagel, Stephen M
Year of Publication 24.07.2007
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Year of Publication 24.07.2007
Patent
INTERCONNECT STRUCTURES COMPRISING CAPPING LAYERS WITH LOW DIELECTRIC CONSTANTS AND METHODS OF MAKING THE SAME
QUON ROGER A, TIEN CHENG, WEI-TSUI TSENG, YUN WANG, SANG OH HYEOK, CHAO-KUN HU, CLEVENGER LAWRENCE A, ZHIGUO SUN, BONILLA GRISELDA, GRUNOW STEPHAN, YIHENG XU
Year of Publication 30.03.2010
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Year of Publication 30.03.2010
Patent
Reduced electromigration and stressed induced migration of Cu wires by surface coating
Hu, Chao-Kun, Rosenberg, Robert, Rubino, Judith, Sambucetti, Carlos, Stamper, Anthony
Year of Publication 25.07.2002
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Year of Publication 25.07.2002
Patent
Copper interconnection structure incorporating a metal seed layer
Edelstein, Daniel Charles, Harper, James McKell Edwin, Hu, Chao-Kun, Simon, Andrew H, Uzoh, Cyprian Emeka
Year of Publication 04.06.2002
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Year of Publication 04.06.2002
Patent
Interconnects with Ti-containing liners
JAMES MCKELL EDWIN HARPER, THOMAS MCCARROLL SHAW, CABRAL, CYRIL, JR, ROY ARTHUR CARRUTHERS, CHAO-KUN HU, KIM YANG LEE, ROBERT ROSENBERG, ISMAIL CEVDET NOYAN
Year of Publication 27.01.2006
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Year of Publication 27.01.2006
Patent
Interconnects with Ti-containing liners
Cabral, Cyril, Carruthers, Roy, Harper, James, Hu, Chao-Kun, Lee, Kim, Noyan, Ismail, Rosenberg, Robert, Shaw, Thomas
Year of Publication 20.06.2002
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Year of Publication 20.06.2002
Patent
Electroplated interconnection structures on integrated circuit chips
Andricacos, Panayotis Constantinou, Deligianni, Harikilia, Dukovic, John Owen, Edelstein, Daniel C, Horkans, Wilma Jean, Hu, Chao-Kun, Hurd, Jeffrey Louis, Rodbell, Kenneth P, Uzoh, Cyprian Emeka, Wong, Kwong-Hon
Year of Publication 20.09.2005
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Year of Publication 20.09.2005
Patent
Interconnects with Ti-containing liners
Cabral, Jr., Cyril, Carruthers, Roy Arthur, Harper, James McKell Edwin, Hu, Chao-Kun, Lee, Kim Yang, Noyan, Ismail Cevdet, Rosenberg, Robert, Shaw, Thomas McCarroll
Year of Publication 07.01.2003
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Year of Publication 07.01.2003
Patent
Aluminum-based metallization exhibiting reduced electromigration and method therefor
Clevenger, Lawrence Alfred, Filippi, Ronald Gene, Rodbell, Kenneth Parker, Iggulden, Roy Charles, Hu, Chao-Kun, Gignac, Lynne Marie, Weber, Stefan, Gambino, Jeffrey Peter, Schnabel, Rainer Florian
Year of Publication 10.09.2002
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Year of Publication 10.09.2002
Patent
Copper recess process with application to selective capping and electroless plating
Chen, Shyng-Tsong, Dalton, Timothy J, Davis, Kenneth M, Hu, Chao-Kun, Jamin, Fen F, Kaldor, Steffen K, Krishnan, Mahadevaiyer, Kumar, Kaushik, Lofaro, Michael F, Malhotra, Sandra G, Narayan, Chandrasekhar, Rath, David L, Rubino, Judith M, Saenger, Katherine L, Simon, Andrew H, Smith, Sean P. E, Tseng, Wei-tsu
Year of Publication 20.06.2006
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Year of Publication 20.06.2006
Patent
Copper recess process with application to selective capping and electroless plating
Dalton, Timothy, Chen, Shyng-Tsong, Davis, Kenneth, Hu, Chao-Kun, Jamin, Fen, Kaldor, Steffen, Krishnan, Mahadevaiyer, Kumar, Kaushik, Lofaro, Michael, Malhotra, Sandra, Narayan, Chandrasekhar, Rath, David, Rubino, Judith, Saenger, Katherine, Simon, Andrew, Smith, Sean, Tseng, Wei-tsu
Year of Publication 17.06.2004
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Year of Publication 17.06.2004
Patent