Fluid colour sign on chest ultrasonography in a cat with exudate pleural effusion and pleuropneumonia
Ho, J.‐C., Chen, H.‐W., Lin, C.‐H., Hu, K.‐C.
Published in Journal of small animal practice (01.08.2019)
Published in Journal of small animal practice (01.08.2019)
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Journal Article
An evaluation of Fuchs-Sondheimer and Mayadas-Shatzkes models below 14nm node wide lines
Smith, R. S., Ryan, E. T., Hu, C.-K., Motoyama, K., Lanzillo, N., Metzler, D., Jiang, L., Demarest, J., Quon, R., Gignac, L., Breslin, C., Giannetta, A., Wright, S.
Published in AIP advances (01.02.2019)
Published in AIP advances (01.02.2019)
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Journal Article
Efficiency measurement of the water recycling system in a fuzzy environment
Huang, H.-C., Liu, F.-B., Hu, C.-K., Hu, C.-F.
Published in Sustainable water resources management (01.06.2024)
Published in Sustainable water resources management (01.06.2024)
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Journal Article
Congenital unilateral pulmonary artery anomaly resulting in pulmonary hypoplasia in a 3‐year‐old adult cat
Lo, P.‐Y., Wu, H.‐D., Hsieh, O. F., Hu, K.‐C., Lin, C.‐H.
Published in Journal of small animal practice (01.01.2018)
Published in Journal of small animal practice (01.01.2018)
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Journal Article
Future on-chip interconnect metallization and electromigration
Hu, C.-K., Kelly, J., Huang, H., Motoyama, K., Shobha, H., Ostrovski, Y., Chen, J. H-C, Patlolla, R., Peethala, B., Adusumilli, P., Spooner, T., Quon, R., Gignac, L. M., Breslin, C., Lian, G., Ali, M., Benedict, J., Lin, X. S., Smith, S., Kamineni, V., Zhang, X., Mont, F., Siddiqui, S., Baumann, F.
Published in 2018 IEEE International Reliability Physics Symposium (IRPS) (01.03.2018)
Published in 2018 IEEE International Reliability Physics Symposium (IRPS) (01.03.2018)
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Conference Proceeding
Glassy state of native collagen fibril?
Gevorkian, S. G, Allahverdyan, A. E, Gevorgyan, D. S, Hu, C.-K
Published in Europhysics letters (01.07.2011)
Published in Europhysics letters (01.07.2011)
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Journal Article
Reduced Cu interface diffusion by CoWP surface coating
Hu, C.-K., Gignac, L., Rosenberg, R., Liniger, E., Rubino, J., Sambucetti, C., Stamper, A., Domenicucci, A., Chen, X.
Published in Microelectronic engineering (01.11.2003)
Published in Microelectronic engineering (01.11.2003)
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Journal Article
Conference Proceeding
Induced Smith-Purcell radiation
Klochkov, D.N., Artemyev, A.I., Oganesyan, K.B., Rostovtsev, Y.V., Hu, C.-K.
Published in Journal of modern optics (20.11.2010)
Published in Journal of modern optics (20.11.2010)
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Journal Article
Technology challenges and enablers to extend Cu metallization to beyond 7 nm node
Nogami, Takeshi, Huang, H., Shobha, H., Patlolla, R., Kelly, J., Penny, C., Hu, C.-K., Sil, D., DeVries, S., Lee, J., Nguyen, S., Jiang, L., Demarest, J., Li, J., Lian, G., Ali, M., Bhosale, P., Lanzillo, N., Motoyama, K., Lian, S., Standaert, T., Bonilla, G., Edelstein, D., Haran, B.
Published in 2019 Symposium on VLSI Technology (01.06.2019)
Published in 2019 Symposium on VLSI Technology (01.06.2019)
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Conference Proceeding
Three-Dimensional Measurement of Line Edge Roughness in Copper Wires Using Electron Tomography
Ercius, Peter, Gignac, Lynne M., Hu, C.-K., Muller, David A.
Published in Microscopy and microanalysis (01.06.2009)
Published in Microscopy and microanalysis (01.06.2009)
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Journal Article
Effective Cu surface pre-treatment for high-reliable 22 nm-node Cu dual damascene interconnects with high plasma resistant ultra low-k dielectric (k = 2.2)
ITO, F, SHOBHA, H, PINTO, T, RYAN, E. T, MADAN, A, HU, C.-K, SPOONER, T, TAGAMI, M, NOGAMI, T, COHEN, S, OSTROVSKI, Y, MOLIS, S, MALONEY, K, FEMIAK, J, PROTZMAN, J
Published in Microelectronic engineering (01.04.2012)
Published in Microelectronic engineering (01.04.2012)
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Conference Proceeding
Journal Article
Electromigration Cu mass flow in Cu interconnections
Hu, C.-K., Canaperi, D., Chen, S.T., Gignac, L.M., Kaldor, S., Krishnan, M., Malhotra, S.G., Liniger, E., Lloyd, J.R., Rath, D.L., Restaino, D., Rosenberg, R., Rubino, J., Seo, S.-C., Simon, A., Smith, S., Tseng, W.-T.
Published in Thin solid films (10.05.2006)
Published in Thin solid films (10.05.2006)
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Journal Article
Conference Proceeding
Interconnects exhibiting enhanced electromigration short-length effects by line width variation
Filippi, R. G., Wang, P.-C, Kim, A. T., Redder, B., Hu, C.-K
Published in 2014 IEEE International Reliability Physics Symposium (01.06.2014)
Published in 2014 IEEE International Reliability Physics Symposium (01.06.2014)
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Conference Proceeding
Copper interconnection integration and reliability
Hu, C.-K., Luther, B., Kaufman, F.B., Hummel, J., Uzoh, C., Pearson, D.J.
Published in Thin solid films (15.06.1995)
Published in Thin solid films (15.06.1995)
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Journal Article
Electromigration in on-chip single/dual damascene Cu interconnections
HU, C.-K, GIGNAC, L, LINIGER, E, ROSENBERG, R
Published in Journal of the Electrochemical Society (01.07.2002)
Published in Journal of the Electrochemical Society (01.07.2002)
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Journal Article
Interconnect scaling challenges, and opportunities to enable system-level performance beyond 30 nm pitch
Bonilla, Griselda, Lanzillo, N., Hu, C.-K., Penny, C.J., Kumar, A.
Published in 2020 IEEE International Electron Devices Meeting (IEDM) (12.12.2020)
Published in 2020 IEEE International Electron Devices Meeting (IEDM) (12.12.2020)
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Conference Proceeding
Loss of heterozygosity of M6P IGF2R gene is an early event in the development of prostate cancer
Hu, C K, McCall, S, Madden, J, Huang, H, Clough, R, Jirtle, R L, Anscher, M S
Published in Prostate cancer and prostatic diseases (01.03.2006)
Published in Prostate cancer and prostatic diseases (01.03.2006)
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Journal Article