Solder void criteria of BTC component investigation
Chun-Chi Chiu, Hsun-Fa Li
Published in 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2017)
Published in 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2017)
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Conference Proceeding
Component drop-off caused by gold embrittlement
Chun-Chi Chiu, Hsun-Fa Li
Published in 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2016)
Published in 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2016)
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Conference Proceeding
Taguchi DoE for ceramic substrate SMT defects improvement
Chun-Cheng Hsu, Ching-Shan Chien, Tzu-Yin Wei, Yun-Tsung Li, Hsun-Fa Li
Published in 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2016)
Published in 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2016)
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Conference Proceeding
Taguchi DoE for Solder Voids Reduction
Chien, Ching-Shan, Chien, Chien-Wen, Li, Yun-Tsung, Li, Hsun-Fa
Published in 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2018)
Published in 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2018)
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Conference Proceeding
Fine pitch BGA solder joint split in SMT process
Chun-Chi Chiu, Yun-Tsung Li, Hsun-Fa Li, Chuei-Tang Wang
Published in 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (01.10.2009)
Published in 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (01.10.2009)
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Conference Proceeding
ACP Mfg. tech. for rigid & flex board interconnection
Ching-Sheng Chang, Ming-Che Wu, Hsun-Fa Li, Chuei-Tang Wang
Published in 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (01.10.2009)
Published in 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (01.10.2009)
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Conference Proceeding
An auto-shielding lid mounting machine system and auto-shielding lid mounting method
LU, WEI, TSENG, CHIU CHIAO, LI, HSUN FA, CHENG, TSUNG JUNG, ZHANG, XIN
Year of Publication 01.06.2015
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Year of Publication 01.06.2015
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