Dimethylimidazolium-Functionalized Polybenzimidazole and Its Organic-Inorganic Hybrid Membranes for Anion Exchange Membrane Fuel Cells
Jheng, Li-Cheng, Cheng, Cheng-Wei, Ho, Ko-Shan, Hsu, Steve Lien-Chung, Hsu, Chung-Yen, Lin, Bi-Yun, Ho, Tsung-Han
Published in Polymers (26.08.2021)
Published in Polymers (26.08.2021)
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Journal Article
Effect of Thickness and Patterns of Graphene Film on High-frequency Power Absorption
Hsu, Chung Yen, Chen, L S
Published in IOP conference series. Earth and environmental science (01.09.2020)
Published in IOP conference series. Earth and environmental science (01.09.2020)
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Journal Article
Characteristics of Thermal Resistance for High Power LEDs
Sheng-Liang Kuo, Chun-Kai Liu, Ming-Ji Dai, Chih-Kuang Yu, Heng-Chieh Chien, Chung-Yen Hsu
Published in 2008 10th Electronics Packaging Technology Conference (01.12.2008)
Published in 2008 10th Electronics Packaging Technology Conference (01.12.2008)
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Conference Proceeding
Thermal performance of the IC package integrated with micro- thermoelectric device
Chun-Kai Liu, Chih-Kuang Yu, Chung-Yen Hsu, Sheng-Liang Kuo, Ming-Ji Dai
Published in 2007 International Microsystems, Packaging, Assembly and Circuits Technology (01.10.2007)
Published in 2007 International Microsystems, Packaging, Assembly and Circuits Technology (01.10.2007)
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Conference Proceeding
A thermoelectric cooler integrated with IHS on a FC-PBGA package
Chih-Kuang Yu, Chun-Kai Liu, Ming-Ji Dai, Sheng-Liang Kuo, Chung-Yen Hsu
Published in 2007 26th International Conference on Thermoelectrics (01.06.2007)
Published in 2007 26th International Conference on Thermoelectrics (01.06.2007)
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Conference Proceeding
Thermo-mechanical analysis of thermoelectric modules
Sheng-Liang Li, Chun-Kai Liu, Chung-Yen Hsu, Ming-Che Hsieh, Ming-Ji Dai, Sheng-Tsai Wu
Published in 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference (01.10.2010)
Published in 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference (01.10.2010)
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Conference Proceeding
Hot spot cooling in 3DIC package utilizing embedded thermoelectric cooler combined with silicon interposer
Sheng-Liang Li, Chung-Yen Hsu, Chun-Kai Liu, Ming-Ji Dai, Heng-Chieh Chien, Ra-Min Tain
Published in 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2011)
Published in 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2011)
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Conference Proceeding
Non-refrigerant thermoelectric air conditioning technique on vehicles
Chung-Yen Hsu, Sheng-Liang Li, Chun-Kai Liu, Ra-Min Tain, Heng-Chieh Chien, Shi-Feng Hsu, Chih-Ming Tzeng, Ming-Ji Dai, Hsu-Shen Chu, Jenn-Dong Hwang
Published in 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2011)
Published in 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2011)
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Conference Proceeding
Thermal simulation and design of GaAs HBTs
Chung-Yen Hsu, Sheng-Liang Kuo, Chun-Kai Liu, Yu-Lin Chao, Ming-Ji Dai, Wang, Y.C., Lin, C.K., Wang, W.K., Li, S.J., Chen, J.
Published in 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (01.10.2009)
Published in 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (01.10.2009)
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Conference Proceeding
Evaluation of the DNA stability of forensic markers used in betel-quid chewers' oral swab samples and oral cancerous specimens: implications for forensic application
Yang, Chiou-herr, Hsieh, Ling-ling, Tsai, Chun-wei, Chiou, Fu-shyan, Chou, Su-lien, Hsu, Ban-dar, Pai, Chung-yen
Published in Journal of forensic sciences (01.01.2003)
Published in Journal of forensic sciences (01.01.2003)
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Journal Article