Amplification of small analytes in polymer solution by capillary electrophoresis
Hsieh, Ming-Mu, Hsu, Chien-En, Tseng, Wei-Lung, Chang, Huan-Tsung
Published in Electrophoresis (01.06.2002)
Published in Electrophoresis (01.06.2002)
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Journal Article
Separation of dsDNA in the presence of electroosmotic flow under discontinuous conditions
Huang, Ming-Feng, Hsu, Chien-En, Tseng, Wei-Lung, Lin, Yu-Cheng, Chang, Huan-Tsung
Published in Electrophoresis (01.07.2001)
Published in Electrophoresis (01.07.2001)
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Journal Article
Sheath–Core Fiber Strain Sensors Driven by in-Situ Crack and Elastic Effects in Graphite Nanoplate Composites
Wu, Jianfeng, Ma, Ziyuan, Hao, Zheng, Zhang, John Tao, Sun, Pengfei, Zhang, Minghao, Liu, Yangkun, Cheng, Yushu, Li, Yu, Zhong, Bo, Zhang, Tao, Xia, Long, Yao, Wang, Huang, Xiaoxiao, Wang, Huatao, Liu, Haiping, Yan, Feng, Hsu, Chien En, Xing, Guozhong
Published in ACS applied nano materials (22.02.2019)
Published in ACS applied nano materials (22.02.2019)
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Journal Article
STRUCTURE OF SEMICONDUCTOR DEVICE
Sheng, Zhirui, Yeh, Chun-Ting, Chen, Hui-Ling, Hsu, Chien En, Kuo, Chung-Hsing, Lin, Ming-Tse
Year of Publication 30.03.2023
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Year of Publication 30.03.2023
Patent
Structure of semiconductor device and method for bonding two substrates
Sheng, Zhirui, Yeh, Chun-Ting, Chen, Hui-Ling, Hsu, Chien En, Kuo, Chung-Hsing, Lin, Ming-Tse
Year of Publication 17.01.2023
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Year of Publication 17.01.2023
Patent
STRUCTURE OF SEMICONDUCTOR DEVICE AND METHOD FOR BONDING TWO SUBSTRATES
Sheng, Zhirui, Yeh, Chun-Ting, Chen, Hui-Ling, Hsu, Chien En, Kuo, Chung-Hsing, Lin, Ming-Tse
Year of Publication 06.01.2022
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Year of Publication 06.01.2022
Patent
Wafer level packaging method
Ding, Wen-Bo, Pang, Chien-Kee, Zhang, Sheng, Sheng, Zhi-Rui, Hsu, Chien-En
Year of Publication 03.03.2020
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Year of Publication 03.03.2020
Patent
WAFER LEVEL PACKAGING METHOD
Ding, Wen-Bo, Pang, Chien-Kee, Zhang, Sheng, Sheng, Zhi-Rui, Hsu, Chien-En
Year of Publication 08.11.2018
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Year of Publication 08.11.2018
Patent