Assembly yield prediction of plastically encapsulated packages with a large number of manufacturing variables by advanced approximate integration method
Wei, Hsiu-Ping, Han, Bongtae, Youn, Byeng D., Shin, Hyuk, Kim, Ilho, Moon, Hojeong
Published in Microelectronics and reliability (01.11.2017)
Published in Microelectronics and reliability (01.11.2017)
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Journal Article
Advanced Statistical Model Calibration to Determine Manufacturing-Induced Variations of Effective Elastic Properties of SAC Solder Joints in Leadless Chip Resistor Assemblies
Wei, Hsiu-Ping, Yang, Yu-Hsiang, Han, Bongtae
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.04.2019)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.04.2019)
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Journal Article
Probabilistic Lifetime Prediction of Electronic Packages Using Advanced Uncertainty Propagation Analysis and Model Calibration
Oh, Hyunseok, Wei, Hsiu-Ping, Han, Bongtae, Youn, Byeng D.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.02.2016)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.02.2016)
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Journal Article
Stacking Yield Prediction of Package-on-Package Considering the Statistical Distributions of Top/Bottom Package Warpages and Solder Ball Heights
Hsiu-Ping Wei, Bongtae Han
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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Conference Proceeding
Prediction of Statistical Distribution of Vibration-Induced Solder Fatigue Failure Considering Intrinsic Variations of Mechanical Properties of Anisotropic Sn-Rich Solder Alloys
Hsiu-Ping Wei, Yu-Hsiang Yang, Bulong Wu, Bongtae Han
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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Conference Proceeding
Chip-packaging interaction in Cu/very low-k interconnect
Hsiu-Ping Wei, Hao-Yi Tsai, Yu-Wen Liu, Hsien-Wei Chen, Shin-Puu Jeng, Yu, D.C.H.
Published in 2009 IEEE International Interconnect Technology Conference (01.06.2009)
Published in 2009 IEEE International Interconnect Technology Conference (01.06.2009)
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Conference Proceeding
A self-aligned airgap interconnect scheme
Hsien-Wei Chen, Shin-Puu Jeng, Hao-Yi Tsai, Yu-Wen Liu, Hsiu-Ping Wei, Yu, D.C.H., Sun, Y.C.
Published in 2009 IEEE International Interconnect Technology Conference (01.06.2009)
Published in 2009 IEEE International Interconnect Technology Conference (01.06.2009)
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Conference Proceeding
Reliability Analysis of a Package-on-Package Structure using the Novel WLCSP Technology with Fan-Out Capability
Hsiu-Ping Wei, Ming-Chih Yew, Wen-Kung Yang, Kuo-Ning Chiang
Published in 2006 International Conference on Electronic Materials and Packaging (01.12.2006)
Published in 2006 International Conference on Electronic Materials and Packaging (01.12.2006)
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Conference Proceeding
A Study of Failure Mechanism and Reliability Assessment for the Panel Level Package (PLP) Technology
Ming-Chih Yew, Hsiu-Ping Wei, Ching-Shun Huang, Dyi-Chung Hu, Wen-Kung Yang, Kou-Ning Chiang
Published in 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 (01.04.2007)
Published in 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 (01.04.2007)
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Conference Proceeding
Clinical information and guidance shared via a patient infotainment system can reduce hospital stay and maintain 2 medical quality for total knee arthroplasty: A single-blinded quasi-randomised controlled trial
Huang, Shan, Kuo, Mei-Ling, Yu, Hsin-Ming, Huang, Chiu-Hui, Shieh, Wann-Yun, Hsu, Wei-Hsiu, Huang, Yo-Ping, Kuo, Feng-Chih, Lee, Mel S.
Published in International journal of nursing studies (01.04.2020)
Published in International journal of nursing studies (01.04.2020)
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Journal Article
Dummy metal design for packaging structures
CHEN CHEN-SHIEN, HOU SHANG-YUN, WU WEING, KUO CHENNG, TSENG MING HUNG, JENG SHIN-PUU, WEI HSIU-PING, CHEN CHIH-HUA, LIU TZUAN-HORNG
Year of Publication 17.06.2014
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Year of Publication 17.06.2014
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