Electroplating apparatus and method considerations for high aspect-ratio through-hole copper electroplating process
Ming-Yao Yen, Yuk-Nam Hung, Kwok-Wai Yee, Hsien-Chang Chen, Hsin-Sen Liang, Lefebvre, Mark
Published in 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference (01.10.2010)
Published in 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference (01.10.2010)
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