by CHANG, Chia-Chan, CHEN, Ying-Chiuan, HSIEH, Sheng-Chi
Published in IEEE microwave and wireless components letters (01.05.2013)

by Chan, Ming-Che, Liao, Tzu Hsin, Hsieh, Chi-Sheng, Jeng, Shie-Chang, Zhuo, Guan-Yu
Published in Optics express (01.02.2021)

by Hsieh, Yu-Chang, Hsiao, Wen-Chun, Huang, Hong-Sheng, Ho, Cheng-Yu, Hsieh, Sheng-Chi, Wang, Chen-Chao
Published in 2023 IEEE CPMT Symposium Japan (ICSJ) (15.11.2023)

by Hsieh, Sheng-Chi, Huang, Hong-Sheng, Hsiao, Wen-Chun, Ho, Cheng-Yu, Wang, Chen-Chao
Published in 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) (11.09.2023)

by Cheng, Kuo-Hung, Hsu, Wei-Lun, Lin, Yuan-Chun, Liu, Jia-Yu, Lin, Shih-Cheng, Chang, Chia-Chan, Hsieh, Sheng-Chi, Wang, Chen-Chao, Chang, Sheng-Fuh
Published in 2023 Asia-Pacific Microwave Conference (APMC) (05.12.2023)

by Kuo, Hung-Chun, Wu, Po-I, Jhong, Ming-Fong, Hsieh, Sheng-Chi, Wang, Chen-Chao
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)

by Hsieh, Sheng-Chi, Huang, Hong-Sheng, Hsiao, Wen-Chun, Ho, Cheng-Yu, Wang, Chen-Chao
Published in 2023 International Conference on Electronics Packaging (ICEP) (19.04.2023)

by Teck Chong Lee, Yung-Shun Chang, Che-Ming Hsu, Sheng-Chi Hsieh, Pao-Nan Lee, Yu-Chang Hsieh, Long-Ching Wang, Lijuan Zhang
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)

by Chang, Chia-Chan, Hsieh, Sheng-Chi, Chen, Chien-Hsun, Huang, Chin-Yen, Yao, Chun-Han, Lin, Chun-Chi
Published in Journal of micromechanics and microengineering (01.12.2011)

by Cheng-Yu Ho, Sheng-Chi Hsieh, Ming-Fong Jhong, Po-Chih Pan, Chen-Chao Wang, Chun-Yen Ting
Published in 2017 IEEE CPMT Symposium Japan (ICSJ) (01.11.2017)

by Chih-Yi Huang, Tsun-Lung Hsieh, Po-Chih Pan, Ming-Fong Jhong, Chen-Chao Wang, Sheng-Chi Hsieh
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)

by Sheng-Chi Hsieh, Pao-Nan Lee, Hsu-Chiang Shih, Chen-Chao Wang, Teck Chong Lee
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)

by Sheng-Chi Hsieh, Chien-Hua Chen, Yung-Shun Chang, Teck Chong Lee, Pao-Nan Lee, Chen-Chao Wang, Yuan-Hsi Chou
Published in 2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) (2016)

by Ming-Fong Jhong, Cheng-Yu Ho, Po-Chih Pan, Hung-Hsiang Cheng, Sheng-Chi Hsieh, Chen-Chao Wang, Lih-Tyng Hwang
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)

by Chun-Chi Lin, Sheng-Chi Hsieh, Chin-Yen Huang, Chia-Chan Chang
Published in Proceedings of the 2012 IEEE International Symposium on Antennas and Propagation (01.07.2012)

by Hsieh, Sheng-Chi, Huang, Hong-Sheng, Hsiao, Wen-Chun, Hsieh, Yu-Chang, Wang, Chen-Chao, Hung, Chih-Pin
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)

by Ho, Cheng-Yu, Hsiao, Wen-Chun, Hsieh, Sheng-Chi, Wang, Chen-Chao, Lee, Hsu-Yang
Published in 2024 International Conference on Electronics Packaging (ICEP) (17.04.2024)

by Chu, Fu-Chen, Hsieh, Sheng-Chi, Wang, Chen-Chao
Published in 2021 16th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (21.12.2021)

by WOMACK MARK D, HSIEH SHENG CHI, LIN YU KUAN, FIRMAN ILYA, LIN JASPER S, TSANG JULIANA
Year of Publication 15.05.2020

by Hsieh, Sheng-Chi, Huang, Hong-Sheng, Hsiao, Wen-Chun, Ho, Cheng-Yu, Lee, Tai-Jung, Wang, Chen-Chao, Lee, Hsu-Yang
Published in 2024 International Conference on Electronics Packaging (ICEP) (17.04.2024)