Determination of Raman Phonon Strain Shift Coefficient of Strained Silicon and Strained SiGe
Wong, L. H., Wong, C. C., Liu, J. P., Sohn, D. K., Chan, L., Hsia, L. C., Zang, H., Ni, Z. H., Shen, Z. X.
Published in Japanese Journal of Applied Physics (01.11.2005)
Published in Japanese Journal of Applied Physics (01.11.2005)
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Journal Article
Characterization of tetra methyl cyclo tetra siloxanes-based low- k dielectric film
Widodo, J., Lu, W., Mhaisalkar, S.G., Hsia, L.C., Tan, P.Y., Shen, L., Zeng, K.Y.
Published in Thin solid films (01.09.2004)
Published in Thin solid films (01.09.2004)
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Journal Article
Adhesion study of tetra methyl cyclo tetra siloxanes (TMCTS) and tri methyl silane (3MS)-based low- k films
Widodo, J., Damayanti, M., Mhaisalkar, S.G., Lu, W., Ong, S., Sritharan, T., Zeng, K.Y., Hsia, L.C.
Published in Microelectronic engineering (01.07.2005)
Published in Microelectronic engineering (01.07.2005)
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Journal Article
Via resistance reduction using cool PVD-Ta processing
SEET, C. S, ZHANG, B. C, TAN, J. B, YONG, Clare, LIEW, S. L, LI, K, HSIA, L. C, SENG, H. L, OSIPOSWICZ, T, SUDIJONO, J, HUA CHUN ZENG
Published in Journal of the Electrochemical Society (01.12.2003)
Published in Journal of the Electrochemical Society (01.12.2003)
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Journal Article
Effects of X-ray irradiation on GIDL in MOSFETs
Acovic, A., Hsu, C.C.-H., Hsia, L.-C., Balasinski, A., Ma, T.-P.
Published in IEEE electron device letters (01.04.1992)
Published in IEEE electron device letters (01.04.1992)
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Journal Article
Stress-induced voiding in multi-level copper/low-k interconnects
Lim, Y.K., Lim, Y.H., Seet, C.S., Zhang, B.C., Chok, K.L., See, K.H., Lee, T.J., Hsia, L.C., Pey, K.L.
Published in 2004 IEEE International Reliability Physics Symposium. Proceedings (2004)
Published in 2004 IEEE International Reliability Physics Symposium. Proceedings (2004)
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Conference Proceeding
Optimization of the Thermomechanical Reliability of a 65 nm Cu/Low- k Large-Die Flip Chip Package
Ong, J.M.G., Tay, A.A.O., Zhang, X., Kripesh, V., Lim, Y.K., Yeo, D., Chan, K.C., Tan, J.B., Hsia, L.C., Sohn, D.K.
Published in IEEE transactions on components and packaging technologies (01.12.2009)
Published in IEEE transactions on components and packaging technologies (01.12.2009)
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Journal Article
Adhesion study of low- k/Si system using 4-point bending and nanoscratch test
Damayanti, M., Widodo, J., Sritharan, T., Mhaisalkar, S.G., Lu, W., Gan, Z.H., Zeng, K.Y., Hsia, L.C.
Published in Materials science & engineering. B, Solid-state materials for advanced technology (15.08.2005)
Published in Materials science & engineering. B, Solid-state materials for advanced technology (15.08.2005)
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Journal Article
Effects of CO2 and O2 on the property of tetra methyl tetra cyclo siloxanes based low-k film
Widodo, J., Lu, W., Mhaisalkar, S.G., Sudijono, J.L., Hsia, L.C., Shen, L., Zeng, K.Y.
Published in Thin solid films (24.01.2005)
Published in Thin solid films (24.01.2005)
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Journal Article
Study of upstream electromigration bimodality and its improvement in Cu low-k interconnects
Liu, W, Lim, Y K, Zhang, F, Liu, H, Zhao, Y H, Du, A Y, Zhang, B C, Tan, J B, Sohn, D K, Hsia, L C
Published in 2010 IEEE International Reliability Physics Symposium (01.05.2010)
Published in 2010 IEEE International Reliability Physics Symposium (01.05.2010)
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Conference Proceeding