Via-Switch FPGA: Highly Dense Mixed-Grained Reconfigurable Architecture With Overlay Via-Switch Crossbars
Ochi, Hiroyuki, Yamaguchi, Kosei, Fujimoto, Tetsuaki, Hotate, Junshi, Kishimoto, Takashi, Higashi, Toshiki, Imagawa, Takashi, Doi, Ryutaro, Tada, Munehiro, Sugibayashi, Tadahiko, Takahashi, Wataru, Wakabayashi, Kazutoshi, Onodera, Hidetoshi, Mitsuyama, Yukio, Yu, Jaehoon, Hashimoto, Masanori
Published in IEEE transactions on very large scale integration (VLSI) systems (01.12.2018)
Published in IEEE transactions on very large scale integration (VLSI) systems (01.12.2018)
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Journal Article
A highly-dense mixed grained reconfigurable architecture with overlay crossbar interconnect using via-switch
Hotate, Junshi, Kishimoto, Takashi, Higashi, Toshiki, Ochi, Hiroyuki, Doi, Ryutaro, Tada, Munehiro, Sugibayashi, Tadahiko, Wakabayashi, Kazutoshi, Onodera, Hidetoshi, Mitsuyama, Yukio, Hashimoto, Masanori
Published in 2016 26th International Conference on Field Programmable Logic and Applications (FPL) (01.08.2016)
Published in 2016 26th International Conference on Field Programmable Logic and Applications (FPL) (01.08.2016)
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Conference Proceeding