A 512Gb 3b/Cell 3D flash memory on a 96-word-line-layer technology
Maejima, Hiroshi, Kanda, Kazushige, Fujimura, Susumu, Takagiwa, Teruo, Ozawa, Susumu, Sato, Jumpei, Shindo, Yoshihiko, Sato, Manabu, Kanagawa, Naoaki, Musha, Junji, Inoue, Satoshi, Sakurai, Katsuaki, Morozumi, Naohito, Fukuda, Ryo, Shimizu, Yuui, Hashimoto, Toshifumi, Xu Li, Shimizu, Yuuki, Abe, Kenichi, Yasufuku, Tadashi, Minamoto, Takatoshi, Yoshihara, Hiroshi, Yamashita, Takahiro, Satou, Kazuhiko, Sugimoto, Takahiro, Kono, Fumihiro, Abe, Mitsuhiro, Hashiguchi, Tomoharu, Kojima, Masatsugu, Suematsu, Yasuhiro, Shimizu, Takahiro, Imamoto, Akihiro, Kobayashi, Naoki, Miakashi, Makoto, Yamaguchi, Kouichirou, Bushnaq, Sanad, Haibi, Hicham, Ogawa, Masatsugu, Ochi, Yusuke, Kubota, Kenro, Wakui, Taichi, Dong He, Weihan Wang, Minagawa, Hiroe, Nishiuchi, Tomoko, Hao Nguyen, Kwang-Ho Kim, Ken Cheah, Yee Koh, Feng Lu, Ramachandra, Venky, Rajendra, Srinivas, Choi, Steve, Payak, Keyur, Raghunathan, Namas, Georgakis, Spiros, Sugawara, Hiroshi, Seungpil Lee, Futatsuyama, Takuya, Hosono, Koji, Shibata, Noboru, Hisada, Toshiki, Kaneko, Tetsuya, Nakamura, Hiroshi
Published in 2018 IEEE International Solid - State Circuits Conference - (ISSCC) (01.02.2018)
Published in 2018 IEEE International Solid - State Circuits Conference - (ISSCC) (01.02.2018)
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Conference Proceeding
30.4 A 1Tb 3b/Cell 3D-Flash Memory in a 170+ Word-Line-Layer Technology
Higuchi, Tsutomu, Kodama, Takuyo, Kato, Koji, Fukuda, Ryo, Tokiwa, Naoya, Abe, Mitsuhiro, Takagiwa, Teruo, Shimizu, Yuki, Musha, Junji, Sakurai, Katsuaki, Sato, Jumpei, Utsumi, Tetsuaki, Yoneya, Kazuhide, Suematsu, Yasuhiro, Hashimoto, Toshifumi, Hioka, Takeshi, Yanagidaira, Kosuke, Kojima, Masatsugu, Matsuno, Junya, Shiraishi, Kei, Yamamoto, Kensuke, Hayashi, Shintaro, Hashiguchi, Tomoharu, Inuzuka, Kazuko, Sugahara, Akio, Honma, Mitsuaki, Tsunoda, Keiji, Yamamoto, Kazumasa, Sugimoto, Takahiro, Fujimura, Tomofumi, Kaneko, Mizuki, Date, Hiroki, Kobayashi, Osamu, Minamoto, Takatoshi, Tachibana, Ryoichi, Yamaguchi, Itaru, Lee, Juan, Ramachandra, Venky, Rajendra, Srinivas, Tang, Tianyu, Darne, Siddhesh, Lee, Jiwang, Li, Jason, Miwa, Toru, Yamashita, Ryuji, Sugawara, Hiroshi, Ookuma, Naoki, Kano, Masahiro, Mizukoshi, Hiroyuki, Kuniyoshi, Yuki, Watanabe, Mitsuyuki, Akiyama, Kei, Mori, Hirotoshi, Arimizu, Akira, Katano, Yoshito, Ehama, Masakazu, Maejima, Hiroshi, Hosono, Koji, Yoshihara, Masahiro
Published in 2021 IEEE International Solid- State Circuits Conference (ISSCC) (13.02.2021)
Published in 2021 IEEE International Solid- State Circuits Conference (ISSCC) (13.02.2021)
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Conference Proceeding
CONTAINER LID COMPRISING METAL THIN PLATE SHELL AND SYNTHETIC RESIN LINER
SHIMOJI SHUMPEI, HOSONO KOJI, OKUBO YUSUKE, KONDO HIDENORI, TSUCHIYA KOICHI, EZAKI MASAHARU
Year of Publication 11.07.2019
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Year of Publication 11.07.2019
Patent
CONTAINER LID WITH SHELL MADE OF THIN METAL SHEET AND LINER MADE OF SYNTHETIC RESIN
SHIMOJI SHUMPEI, HOSONO KOJI, OKUBO YUSUKE, KONDO HIDENORI, TSUCHIYA KOICHI, EZAKI MASAHARU
Year of Publication 22.12.2016
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Year of Publication 22.12.2016
Patent