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Year of Publication 08.06.2023
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Year of Publication 08.06.2023
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METHOD OF FORMING AN INTERCONNECT METALLISATION BY PANEL LEVEL PACKAGING AND THE CORRESPONDING DEVICE
Flauta, Randolph Estal, Zhou, Zhou, Kan, Wae Lam, Hor, Wai Hung William
Year of Publication 07.06.2023
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Year of Publication 07.06.2023
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Through hole side wettable flank
Walczyk, Sven, Funke, Hans-Juergen, Lam, Kan Wae, Hor, Wai Hung William
Year of Publication 18.01.2022
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Year of Publication 18.01.2022
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THROUGH HOLE SIDE WETTABLE FLANK
Walczyk, Sven, Funke, Hans-Juergen, Lam, Kan Wae, Hor, Wai Hung William
Year of Publication 12.11.2020
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Year of Publication 12.11.2020
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A leadless semiconductor package and method
Habenicht, Soenke, Chi Ho Leung, Chan, San Ming, Xue, Ke, Hor, Wai Hung William, Ng, Wai Keung
Year of Publication 27.11.2019
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Year of Publication 27.11.2019
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Package with multiple I/O side-solderable terminals
Hor Wai Hung William, Fung Yee Wai, Leung Chi Ho, Ho WaiKeung, Umali Pompeo, Habenicht Soenke
Year of Publication 23.08.2016
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Year of Publication 23.08.2016
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Leadless semiconductor package and method
Xue Ke, Hor Wai Hung William, Leung Chi Ho, Chan San Ming, Ng Wai Keung, Habenicht Soenke
Year of Publication 13.09.2016
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Year of Publication 13.09.2016
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PACKAGE WITH MULTIPLE I/O SIDE-SOLDERABLE TERMINALS
FUNG YEE WAI, LEUNG CHI HO, HOR WAI HUNG WILLIAM, UMALI POMPEO, HO WAIKEUNG, HABENICHT SOENKE
Year of Publication 05.05.2016
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Year of Publication 05.05.2016
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A leadless semiconductor package and method
KE XUE, WAI HUNG WILLIAM HOR, WAI KEUNG NG, SAN MING CHAN, CHI HO LEUNG, SOENKE HABENICHT
Year of Publication 10.02.2016
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Year of Publication 10.02.2016
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LEADLESS SEMICONDUCTOR PACKAGE AND METHOD
NG WAI KEUNG, XUE KE, LEUNG CHI HO, HOR WAI HUNG WILLIAM, CHAN SAN MING, HABENICHT SOENKE
Year of Publication 04.02.2016
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Year of Publication 04.02.2016
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A leadless semiconductor package and method
CHAN, SAN MING, NG, WAI KEUNG, HOR, WAI HUNG WILLIAM, HABENICHT, SOENKE, CHI HO LEUNG, XUE, KE
Year of Publication 03.02.2016
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Year of Publication 03.02.2016
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Package with multiple I/O side-solderable terminals
WAI KEUNG HO, WAI HUNG WILLIAM HOR, YEE WAI FUNG, POMPEO UMALI, CHI HO LEUNG, SOENKE HABENICHT
Year of Publication 11.05.2016
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Year of Publication 11.05.2016
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