Observation of amorphous chromium in modified C4 flip chip solder joints after thermal stress testing
Hooghan, T.K, Nakahara, S, Hooghan, K, Privette, R.W, Bachman, M.A, Moyer, R.S
Published in Thin solid films (01.08.2003)
Published in Thin solid films (01.08.2003)
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Journal Article
Sn whiskers: material, design, processing, and post-plate reflow effects and development of an overall phenomenological theory
Osenbach, J.W., Shook, R.L., Vaccaro, B.T., Potteiger, B.D., Amin, A.N., Hooghan, K.N., Suratkar, P., Ruengsinsub, P.
Published in IEEE transactions on electronics packaging manufacturing (01.01.2005)
Published in IEEE transactions on electronics packaging manufacturing (01.01.2005)
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Journal Article
Conference Proceeding
SEM-FIB Characterization of Reverse Osmosis Membrane Fouling
Behzad, A, Hooghan, K, Aubry, C, Khan, M, Croue, J
Published in Microscopy and microanalysis (01.07.2011)
Published in Microscopy and microanalysis (01.07.2011)
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Journal Article
Microscopy of Materials Used in the Semiconductor Industry
Merchant, S M, DeLucca, J M, Hooghan, K N, Baiocchi, F A
Published in Microscopy and microanalysis (01.08.2005)
Published in Microscopy and microanalysis (01.08.2005)
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Journal Article
Physical failure analysis deprocessing and cross-section techniques for Cu/low-k technology
Huixian Wu, Hooghan, K., Cargo, J.
Published in IEEE transactions on device and materials reliability (01.03.2004)
Published in IEEE transactions on device and materials reliability (01.03.2004)
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Magazine Article