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INTEGRATED BARE DIE PACKAGE, AND RELATED FABRICATION METHODS
by
KREFFT, Anna Katharina
,
HOO
,
Yeng Kwan
,
TOPAL, Emre
Year of Publication
20.06.2024
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INTEGRATED BARE DIE PACKAGE, AND RELATED FABRICATION METHODS
by
Hoo
,
Yeng Kwan
,
Topal, Emre
,
Krefft, Anna Katharina
Year of Publication
20.06.2024
Get full text
Patent
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chemistry
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basic electric elements
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electric solid state devices not otherwise provided for
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electricity
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basic electronic circuitry
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impedance networks, e.g. resonant circuits
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