Microstructural evolution and semisolid forming of SiC particulate reinforced AZ91HP magnesium composites
Hong, T.W., Kim, S.K., Ha, H.S., Kim, M.G., Lee, D.B., Kim, Y.J.
Published in Materials science and technology (01.07.2000)
Published in Materials science and technology (01.07.2000)
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Conference Proceeding
A Review: Characteristics of Noise Absorption Material
Amares, S, Sujatmika, E, Hong, T W, Durairaj, R, Hamid, H S H B
Published in Journal of physics. Conference series (01.10.2017)
Published in Journal of physics. Conference series (01.10.2017)
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Protecting free expression online with Freenet
Clarke, I., Miller, S.G., Hong, T.W., Sandberg, O., Wiley, B.
Published in IEEE internet computing (01.01.2002)
Published in IEEE internet computing (01.01.2002)
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Recent Development on Fracture Analysis of Solder Joints
Ooi, E.P., Daud, R., Amin, N.A.M., Hong, T.W.
Published in Applied Mechanics and Materials (07.11.2014)
Published in Applied Mechanics and Materials (07.11.2014)
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Finite Element Modeling of Intermetallic Compound (IMC) Solder Joints Fracture: Part A
Hong, T.W., Afendi, Mohd, Ooi, Eang Pang, Amin, N.A.M., Ariffin, Ahmad Kamal, Mohamad, Azizul, Abdul Majid, M.S., Daud, Ruslizam
Published in Applied Mechanics and Materials (26.08.2015)
Published in Applied Mechanics and Materials (26.08.2015)
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Finite Element Modeling of Intermetallic Compound (IMC) Solder Joints Fracture: Part B
Afendi, M., Ooi, Eang Pang, Amin, N.A.M., Hong, T.W., Mohamad, Azizul, Abdul Majid, M.S., Daud, Ruslizam, Ariffin, Ahmad Kamal
Published in Applied Mechanics and Materials (26.08.2015)
Published in Applied Mechanics and Materials (26.08.2015)
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