Search Results - "Holloway Jeffrey Gail" :: K.UTB vyhledávací portál

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Semiconductor package with cantilever leads

by Holloway Jeffrey Gail
Year of Publication 18.04.2017

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Patent

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Semiconductor package with interconnected leads

by Holloway, Jeffrey Gail, Tran, Andy Quang
Year of Publication 21.01.2020

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Patent

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Semiconductor package with cantilever leads

by HOLLOWAY JEFFREY GAIL
Year of Publication 19.01.2016

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Patent

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SEMICONDUCTOR PACKAGE WITH INTERCONNECTED LEADS

by Holloway, Jeffrey Gail, Tran, Andy Quang
Year of Publication 27.09.2018

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Patent

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Semiconductor Package with Cantilever Leads

by HOLLOWAY JEFFREY GAIL
Year of Publication 07.08.2014

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Patent

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Semiconductor Package with Cantilever Leads

by HOLLOWAY JEFFREY GAIL
Year of Publication 09.08.2012

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Patent

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Methods and devices for manufacturing cantilever leads in a semiconductor package

by Holloway, Jeffrey Gail
Year of Publication 10.07.2012

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Patent

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Methods and devices for manufacturing cantilever leads in a semiconductor package

by HOLLOWAY JEFFREY GAIL
Year of Publication 10.07.2012

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Patent

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METHODS AND DEVICES FOR MANUFACTURING CANTILEVER LEADS IN A SEMICONDUCTOR PACKAGE

by HOLLOWAY JEFFREY GAIL
Year of Publication 21.04.2011

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Patent

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Plastic semiconductor packages having improved metal land-locking features

by Holloway, Jeffrey Gail, Kummerl, Steven Alfred
Year of Publication 17.03.2009

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Patent

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Plastic semiconductor packages having improved metal land-locking features

by HOLLOWAY JEFFREY GAIL, KUMMERL STEVEN ALFRED
Year of Publication 17.03.2009

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Patent

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PLASTIC SEMICONDUCTOR PACKAGES HAVING IMPROVED METAL LAND-LOCKING FEATURES

by HOLLOWAY, JEFFREY, GAIL, KUMMERL, STEVEN, ALFRED
Year of Publication 24.07.2008

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Patent

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PLASTIC SEMICONDUCTOR PACKAGES HAVING IMPROVED METAL LAND-LOCKING FEATURES

by HOLLOWAY JEFFREY GAIL, KUMMERL STEVEN ALFRED
Year of Publication 17.07.2008

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Patent

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Non-Pull Back Pad Package with an Additional Solder Standoff

by LANGE BERNHARD P, COYLE ANTHONY L, HOLLOWAY JEFFREY GAIL
Year of Publication 14.01.2010

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Patent

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Non-pull back pad package with an additional solder standoff

by Lange, Bernhard P, Coyle, Anthony L, Holloway, Jeffrey Gail
Year of Publication 27.10.2009

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Patent

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Non-pull back pad package with an additional solder standoff

by LANGE BERNHARD P, COYLE ANTHONY L, HOLLOWAY JEFFREY GAIL
Year of Publication 27.10.2009

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Patent

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NON-PULL BACK PAD PACKAGE WITH AN ADDITIONAL SOLDER STANDOFF

by LANGE, BERNHARD, P, HOLLOWAY, JEFFREY, GAIL, COYLE, ANTHONY, L
Year of Publication 26.06.2008

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Patent

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SEMICONDUCTOR DIES AND METHODS AND APPARATUS TO MOLD LOCK A SEMICONDUCTOR DIE

by LANGE, BERNHARD, PETER, HOLLOWAY, JEFFREY, GAIL, KUMMERL, STEVEN, ALFRED
Year of Publication 12.06.2008

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Patent

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NON-PULL BACK PAD PACKAGE WITH AN ADDITIONAL SOLDER STANDOFF

by LANGE, BERNHARD, P, HOLLOWAY, JEFFREY, GAIL, COYLE, ANTHONY, L
Year of Publication 08.05.2008

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Patent

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Non-Pull Back Pad Package with an Additional Solder Standoff

by LANGE BERNHARD P, COYLE ANTHONY L, HOLLOWAY JEFFREY GAIL
Year of Publication 01.05.2008

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Patent

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