Experimental and computational studies on the role of surface functional groups in the mechanical behavior of interfaces between single-walled carbon nanotubes and metals
Hartmann, Steffen, Sturm, Heinz, Blaudeck, Thomas, Hölck, Ole, Hermann, Sascha, Schulz, Stefan E, Gessner, Thomas, Wunderle, Bernhard
Published in Journal of materials science (01.02.2016)
Published in Journal of materials science (01.02.2016)
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Journal Article
Atomistic packing models for experimentally investigated swelling states induced by CO2 in glassy polysulfone and poly(ether sulfone)
Heuchel, Matthias, Böhning, Martin, Hölck, Ole, Siegert, Martin R., Hofmann, Dieter
Published in Journal of polymer science. Part B, Polymer physics (01.07.2006)
Published in Journal of polymer science. Part B, Polymer physics (01.07.2006)
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Journal Article
In-situ infrared spectroscopy for chemical analysis in electronic packaging processes
Niegisch, Corinna, Haag, Sabine, Braun, Tanja, Holck, Ole, Schneider-Ramelow, Martin
Published in 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) (13.09.2022)
Published in 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) (13.09.2022)
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Conference Proceeding
Improving Warpage Characterization of Large Wafers in Fan-Out Packaging Technology
Huber, Saskia, Stegmaier, Andreas, van Dijk, Marius, Nguyen, Nina, Holck, Ole, Wittler, Olaf, Schneider-Ramelow, Martin
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
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Conference Proceeding
Gas-induced structural changes in polymeric membrane materials combining experiment, phenomenological models and simulation
Hölck, Ole, Böhning, Martin, Heuchel, Matthias, Siegert, Martin R.
Published in Desalination (20.11.2006)
Published in Desalination (20.11.2006)
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Journal Article
Conference Proceeding
A Closer Look to Fan-out Panel Level Packaging
Braun, Tanja, Holck, Ole, Voitel, Marcus, Obst, Mattis, Voges, Steve, Becker, Karl-Friedrich, Aschenbrenner, Rolf, Schneider-Ramelow, Martin
Published in 2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) (07.03.2023)
Published in 2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) (07.03.2023)
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Conference Proceeding
Atomistic packing models for experimentally investigated swelling states induced by CO2 in glassy polymers
HEUCHEL, Matthias, BÖHNING, Martin, HÖLCK, Ole, SIEGERT, Martin R, HOFMANN, Dieter
Published in Desalination (20.11.2006)
Published in Desalination (20.11.2006)
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Conference Proceeding
Journal Article
Development of a Scalable AiP Module for mmWave 5G MIMO Applications Based on a Double Molded FOWLP Approach
Braun, Tanja, Le, Thi Huyen, Rossi, Marco, Ndip, Ivan, Holck, Ole, Becker, Karl-Friedrich, Bottcher, Mathias, Schiffer, Michael, Aschenbrenner, Rolf, Muller, Friedrich, Voitel, Marcus, Schneider-Ramelow, Martin, Wieland, Marcel, Goetze, Christian, Trewhella, Jean, Berger, Daniel
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
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Conference Proceeding
Thin Film Encapsulation for LCP-Based Flexible Bioelectronic Implants: Comparison of Different Coating Materials Using Test Methodologies for Life-Time Estimation
Pak, Anna, Nanbakhsh, Kambiz, Hölck, Ole, Ritasalo, Riina, Sousa, Maria, Van Gompel, Matthias, Pahl, Barbara, Wilson, Joshua, Kallmayer, Christine, Giagka, Vasiliki
Published in Micromachines (Basel) (30.03.2022)
Published in Micromachines (Basel) (30.03.2022)
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Journal Article
An in situ tensile test device for thermo-mechanical characterisation of interfaces between carbon nanotubes and metals
Hartmann, Steffen, Bonitz, Jens, Heggen, Marc, Hermann, Sascha, Holck, Ole, Schulz, Stefan E., Gessner, Thomas, Wunderle, Bernhard
Published in 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2016)
Published in 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2016)
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Conference Proceeding
Why Should We Share Material Data? The Positive Impact of Public/Private Databases Access Through Digital Twins Along the Product Value Chain
Holck, Ole, Voges, Steve, Becker, Karl-Friedrich, Wagner, Eduard, Schneider-Ramelow, Martin
Published in 2024 Electronics Goes Green 2024+ (EGG) (18.06.2024)
Published in 2024 Electronics Goes Green 2024+ (EGG) (18.06.2024)
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Conference Proceeding
Gas sorption isotherms in swelling glassy polymers—Detailed atomistic simulations
Hölck, Ole, Böhning, Martin, Heuchel, Matthias, Siegert, Martin R., Hofmann, Dieter
Published in Journal of membrane science (01.02.2013)
Published in Journal of membrane science (01.02.2013)
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Journal Article
Inline cure monitoring of epoxy resin by dielectric analysis
Franieck, Erick, Fleischmann, Martin, Holck, Ole, Schneider-Ramelow, Martin
Published in 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC) (13.09.2021)
Published in 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC) (13.09.2021)
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Conference Proceeding
In-Package Characterization of Dielectrics Using Ring Resonators and Adaptive 3D EM-Simulations Around 77 GHz
Stadler, Pascal, Braun, Tobias T., Geissler, Christian, Scheibe, Philipp, Braun, Tanja, Holck, Ole, Romstadt, Justin, Pohl, Nils
Published in 2024 15th German Microwave Conference (GeMiC) (11.03.2024)
Published in 2024 15th German Microwave Conference (GeMiC) (11.03.2024)
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Conference Proceeding
How to Manipulate Warpage in Fan-out Wafer and Panel Level Packaging
Braun, Tanja, Holck, Ole, Adler, Marius, Obst, Mattis, Voges, Steve, Becker, Karl-Friedrich, Aschenbrenner, Rolf, Voitel, Marcus, Dreissigacker, Marc, Schneider-Ramelow, Martin
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding
Warpage of Fan-Out Panel Level Packaging - Experimental and Numerical Study of Geometry and Process Influence
Stegmaier, Andreas, Holck, Ole, Dijk, Marius van, Walter, Hans, Wittler, Olaf, Schneider-Ramelow, Martin
Published in 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (17.04.2023)
Published in 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (17.04.2023)
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Conference Proceeding
Molecular dynamic simulations of maximum pull-out forces of embedded CNTs for sensor applications and validating nano scale experiments
Hartmann, Steffen, Hölck, Ole, Blaudeck, Thomas, Hermann, Sascha, Schulz, Stefan E., Gessner, Thomas, Wunderle, Bernhard
Published in 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2014)
Published in 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2014)
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Conference Proceeding