by Hokazono, A., Balasubramanian, S., Ishimaru, K., Ishiuchi, H., Hu, C., Liu, T.-J.K.
Published in IEEE transactions on electron devices (01.10.2008)

by Kinno, T., Akutsu, H., Tomita, M., Kawanaka, S., Sonehara, T., Hokazono, A., Renaud, L., Martin, I., Benbalagh, R., Sallé, B., Takeno, S.
Published in Applied surface science (15.10.2012)

by Hokazono, A., Balasubramanian, S., Ishimaru, K., Ishiuchi, H., Chenming Hu, Tsu-Jae King Liu
Published in IEEE electron device letters (01.07.2006)

by Hokazono, A., Balasubramanian, S., Ishimaru, K., Ishiuchi, H., Tsu-Jae King Liu, Chenming Hu
Published in IEEE electron device letters (01.05.2006)

by Tsugawa, K, Kitatani, K, Noda, H, Hokazono, A, Hirose, K, Tajima, M, Kawarada, H
Published in Diamond and related materials (1999)

by Inaba, S., Okano, K., Matsuda, S., Fujiwara, M., Hokazono, A., Adachi, K., Ohuchi, K., Suto, H., Fukui, H., Shimizu, T., Mori, S., Oguma, H., Murakoshi, A., Itani, T., Iinuma, T., Kudo, T., Shibata, H., Taniguchi, S., Takayanagi, M., Azuma, A., Oyamatsu, H., Suguro, K., Katsumata, Y., Toyoshima, Y., Ishiuchi, H.
Published in IEEE transactions on electron devices (01.12.2002)

by Hokazono, A., Ishikura, T., Nakamura, K., Yamashita, S., Kawarada, H.
Published in Diamond and related materials (01.03.1997)

by Hokazono, A., Itokawa, H., Kusunoki, N., Mizushima, I., Inaba, S., Kawanaka, S., Toyoshima, Y.
Published in 2008 Symposium on VLSI Technology (01.06.2008)

by Hokazono, A, Tsugawa, K, Umezana, H, Kitatani, K, Kawarada, H
Published in Solid-state electronics (01.08.1999)

by Inaba, S., Miyano, K., Nagano, H., Hokazono, A., Ohuchi, K., Mizushima, I., Oyamatsu, H., Tsunashima, Y., Ishimaru, K., Toyoshima, Y., Ishiuchi, H.
Published in IEEE transactions on electron devices (01.09.2004)

by Noda, H., Hokazono, A., Kawarada, H.
Published in Diamond and related materials (01.04.1997)

by KAWARADA, H, ITOH, M, HOKAZONO, A
Published in Japanese Journal of Applied Physics (01.09.1996)

by Miyata, T., Tanaka, H., Kagimoto, K., Kamiyashiki, M., Kamimura, M., Hidaka, A., Goto, M., Adachi, K., Hokazono, A., Ohguro, T., Nagaoka, K., Watanabe, Y., Hirooka, S., Ito, Y., Kawanaka, S., Ishimaru, K.
Published in 2015 IEEE International Electron Devices Meeting (IEDM) (01.12.2015)

by Soeda, T.(Kyushu Kyoritsu Univ., Kitakyushu, Fukuoka (Japan)), Kasagi, T, Hokazono, A
Published in Nihon Shokuhin Kagaku Kōgaku kaishi (01.11.2005)

by Soeda, T.(Kyushu Kyoritsu Univ., Kitakyushu, Fukuoka (Japan)), Kasagi, T, Hokazono, A, Yamazaki, K, Muguruma, M
Published in Nihon Shokuhin Kagaku Kōgaku kaishi (01.01.2006)

by Hokazono, A., Itokawa, H., Mizushima, I., Kawanaka, S., Inaba, S., Toyoshima, Y.
Published in 2009 IEEE International Electron Devices Meeting (IEDM) (01.12.2009)

by Hokazono, A, Itokawa, H, Kusunoki, N, Mizushima, I, Inaba, S, Kawanaka, S, Toyoshima, Y
Published in IEEE transactions on electron devices (01.05.2011)

by Tsugawa, K., Noda, H., Hokazono, A., Kitatani, K., Morita, K., Kawarada, H.
Published in Electronics & communications in Japan. Part 2, Electronics (01.07.1998)

by Sonehara, T., Hokazono, A., Akutsu, H., Sasaki, T., Uchida, H., Tomita, M., Kawanaka, S., Inaba, S., Toyoshima, Y.
Published in IEEE transactions on electron devices (01.11.2011)

by Miyata, T., Kawanaka, S., Hokazono, A., Ohguro, T., Toyoshima, Y.
Published in 2013 Symposium on VLSI Technology (01.06.2013)