Deposition, Characterization, and Modeling of Scandium-Doped Aluminum Nitride Thin Film for Piezoelectric Devices
Zhang, Qiaozhen, Chen, Mingzhu, Liu, Huiling, Zhao, Xiangyong, Qin, Xiaomei, Wang, Feifei, Tang, Yanxue, Yeoh, Keat Hoe, Chew, Khian-Hooi, Sun, Xiaojuan
Published in Materials (27.10.2021)
Published in Materials (27.10.2021)
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Enhancement of the work function of indium tin oxide by surface modification using caesium fluoride
Whitcher, Thomas J, Yeoh, Keat Hoe, Ng, Yi Bin Calvin, Talik, Noor Azrina, Chua, Chong Lim, Woon, Kai Lin, Chanlek, Narong, Nakajima, Hideki, Saisopa, Thanit, Songsiriritthigul, Prayoon, Oswald, Steffen, Yap, Boon Kar
Published in Journal of physics. D, Applied physics (27.11.2013)
Published in Journal of physics. D, Applied physics (27.11.2013)
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First-principles studies on the superconductivity of aluminene
Yeoh, Keat Hoe, Yoon, Tiem Leong, Rusi, Ong, Duu Sheng, Lim, Thong Leng
Published in Applied surface science (01.07.2018)
Published in Applied surface science (01.07.2018)
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Journal Article
Strain-Induced SiP–PtS2 Heterostructure with Fast Carrier Transport for Boosted Photocatalytic Hydrogen Conversion
Chang, Yee Hui Robin, Yao, Kaiyuan, Yeoh, Keat Hoe, Yoshiya, Masato, Jiang, Junke, Tuh, Moi Hua, Khong, Heng Yen, Lim, Thong Leng
Published in Journal of physical chemistry. C (06.07.2023)
Published in Journal of physical chemistry. C (06.07.2023)
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Journal Article
Weibull-Fréchet random path length model for avalanche gain and noise in photodiodes
Ong, Duu Sheng, Tan, Ai Hui, Choo, Kan Yeep, Yeoh, Keat Hoe, David, John P R
Published in Journal of physics. D, Applied physics (10.02.2022)
Published in Journal of physics. D, Applied physics (10.02.2022)
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Achieving type-II SnSSe/as van der waals heterostructure with satisfactory oxygen tolerance for optoelectronic and photovoltaic applications
Robin Chang, Yee Hui, Jiang, Junke, Yeoh, Keat Hoe, Abdullahi, Yusuf Zuntu, Khong, Heng Yen, Tuh, Moi Hua, Liew, Fui Kiew, Liew, Yit Lian
Published in Journal of solid state chemistry (01.05.2023)
Published in Journal of solid state chemistry (01.05.2023)
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Stabilizing XPbI 3 (X = MA, FA and Cs) cubic perovskites by monolayer Ag 4 Se 2 deposition
Chang, Yee Hui Robin, Yeoh, Keat Hoe, Lim, Thong Leng, Lim, Kok-Geng, Tuh, Moi Hua
Published in New journal of chemistry (17.01.2022)
Published in New journal of chemistry (17.01.2022)
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Journal Article
Stabilizing XPbI (X = MA, FA and Cs) cubic perovskites by monolayer AgSe deposition
Chang, Yee Hui Robin, Yeoh, Keat Hoe, Lim, Thong Leng, Lim, Kok-Geng, Tuh, Moi Hua
Published in New journal of chemistry (17.01.2022)
Published in New journal of chemistry (17.01.2022)
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Journal Article
Strain-Induced SiP–PtS 2 Heterostructure with Fast Carrier Transport for Boosted Photocatalytic Hydrogen Conversion
Chang, Yee Hui Robin, Yao, Kaiyuan, Yeoh, Keat Hoe, Yoshiya, Masato, Jiang, Junke, Tuh, Moi Hua, Khong, Heng Yen, Lim, Thong Leng
Published in Journal of physical chemistry. C (06.07.2023)
Published in Journal of physical chemistry. C (06.07.2023)
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Prediction of stable silver selenide-based energy materials sustained by rubidium selenide alloying
Chang, Yee Hui Robin, Jiang, Junke, Yeoh, Keat Hoe, Tuh, Moi Hua, Chiew, Fei Ha
Published in New journal of chemistry (28.11.2022)
Published in New journal of chemistry (28.11.2022)
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Journal Article
Critical Threshold Limit for Effective Solder Void Size Reduction by Vacuum Reflow Process for Power Electronics Packaging
Yeo, Siang Miang, Yow, Ho-Kwang, Yeoh, Keat Hoe
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.07.2023)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.07.2023)
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Journal Article
Boosting the solar conversion efficiency of MoSe2/PtX2 (X = O, S) vdW heterostructure by strain and electric field engineering
Chang, Yee Hui Robin, Yeoh, Keat Hoe, Jiang, Junke, Khong, Heng Yen, Mahat, Mohd Muzamir, Chai, Soo See, Liew, Fui Kiew, Tuh, Moi Hua
Published in Physica scripta (01.11.2022)
Published in Physica scripta (01.11.2022)
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Journal Article
Solder void size reduction in semiconductor package by vacuum reflow and pressure cure processes
Yeo, Siang Miang, Yow, Ho Kwang, Yeoh, Keat Hoe
Published in Soldering & surface mount technology (17.06.2022)
Published in Soldering & surface mount technology (17.06.2022)
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