Thermal Conductivity and Mechanical Properties of Polymer Composites with Hexagonal Boron Nitride-A Comparison of Three Processing Methods: Injection Moulding, Powder Bed Fusion and Casting
Do, Nu Bich Duyen, Imenes, Kristin, Aasmundtveit, Knut E, Nguyen, Hoang-Vu, Andreassen, Erik
Published in Polymers (01.03.2023)
Published in Polymers (01.03.2023)
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Black Silicon as Anti-Reflective Structure for Infrared Imaging Applications
Bardalen, Eivind, Bouchouri, Angelos, Akram, Muhammad Nadeem, Nguyen, Hoang-Vu
Published in Nanomaterials (Basel, Switzerland) (20.12.2023)
Published in Nanomaterials (Basel, Switzerland) (20.12.2023)
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Design of Silicon Cap for Hermetic Packaging of Microbolometer Focal Plane Arrays
Xia, Hexin, Akram, Muhammad Nadeem, Roy, Avisek, Bardalen, Eivind, Nguyen, Hoang-Vu, Hoivik, Nils, Aasmundtveit, Knut Eilif, Ohlckers, Per
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.03.2022)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.03.2022)
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Journal Article
Rheological characterization of a novel isotropic conductive adhesive – Epoxy filled with metal-coated polymer spheres
Nguyen, Hoang-Vu, Andreassen, Erik, Kristiansen, Helge, Johannessen, Rolf, Hoivik, Nils, Aasmundtveit, Knut E.
Published in Materials in engineering (01.04.2013)
Published in Materials in engineering (01.04.2013)
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In–Bi low-temperature SLID bonding for piezoelectric materials
Aasmundtveit, Knut E, Eggen, Trym, Manh, Tung, Nguyen, Hoang-Vu
Published in Soldering & surface mount technology (27.03.2018)
Published in Soldering & surface mount technology (27.03.2018)
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Unsupervised interaction-preserving discretization of multivariate data
Nguyen, Hoang-Vu, Müller, Emmanuel, Vreeken, Jilles, Böhm, Klemens
Published in Data mining and knowledge discovery (01.09.2014)
Published in Data mining and knowledge discovery (01.09.2014)
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A Novel SiC-Based Multifunctional Onboard Battery Charger for Plug-In Electric Vehicles
Nguyen, Hoang Vu, Lee, Dong-Choon, Blaabjerg, Frede
Published in IEEE transactions on power electronics (01.05.2021)
Published in IEEE transactions on power electronics (01.05.2021)
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Journal Article
A DNA Origami-Based Chiral Plasmonic Sensing Device
Huang, Yike, Nguyen, Minh-Kha, Natarajan, Ashwin Karthick, Nguyen, Vu Hoang, Kuzyk, Anton
Published in ACS applied materials & interfaces (26.12.2018)
Published in ACS applied materials & interfaces (26.12.2018)
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Journal Article
Die Shear Testing of a Novel Isotropic Conductive Adhesive-Epoxy Filled With Metal-Coated Polymer Spheres
Nguyen, Hoang-Vu, Andreassen, Erik, Kristiansen, Helge, Aasmundtveit, Knut E.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.07.2013)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.07.2013)
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Journal Article
Ag-(In-Bi) Solid–Liquid Interdiffusion Bonding
Kuziora, Stéphane Léonard, Nguyen, Hoang-Vu, Aasmundtveit, Knut Eilif
Published in Journal of electronic materials (01.02.2023)
Published in Journal of electronic materials (01.02.2023)
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Journal Article
Ag–(In–Bi) solid-state bonding
Kuziora, Stéphane Léonard, Nguyen, Hoang-Vu, Aasmundtveit, Knut Eilif
Published in Journal of materials science. Materials in electronics (01.06.2023)
Published in Journal of materials science. Materials in electronics (01.06.2023)
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