Investigation of a photoelectrochemical passivated ZnO-based glucose biosensor
Lee, Ching-Ting, Chiu, Ying-Shuo, Ho, Shu-Ching, Lee, Yao-Jung
Published in Sensors (Basel, Switzerland) (01.05.2011)
Published in Sensors (Basel, Switzerland) (01.05.2011)
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Journal Article
An experimental and numerical investigation into the effects of the chip-on-film (COF) processing parameters on the Au-Sn bonding temperature
Liu, De-Shin, Yeh, Shu-Shen, Kao, Chun-Teh, Huang, Pay-Yau, Tsai, Chia-I, Liu, An-Hong, Ho, Shu-Ching
Published in Soldering & surface mount technology (01.01.2010)
Published in Soldering & surface mount technology (01.01.2010)
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Journal Article
Wide linear sensing sensors using ZnO:Ta extended-gate field-effect-transistors
Chiu, Ying-Shuo, Lee, Ching-Ting, Lou, Li-Ren, Ho, Shu-Ching, Chuang, Chun-Te
Published in Sensors and actuators. B, Chemical (01.11.2013)
Published in Sensors and actuators. B, Chemical (01.11.2013)
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Journal Article
Novel analysis model for investigation of contact force and scrub length for design of probe card
Liu, De-Shin, Chang, Chi-Min, Liu, John, Ho, Shu-Ching, Tsai, Hao-Yin
Published in Microelectronics and reliability (01.06.2010)
Published in Microelectronics and reliability (01.06.2010)
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Journal Article
Effect of heat treatment on structure and properties of dispersed-type dental amalgam
Ju, Chien-Ping, Chen, Yu-Hsuan, Ho, Wen-Fu, Ho, Shu-Ching, Chen, Wen-Cheng, Shieh, Dar-Bin, Chern Lin, Jiin-Huey
Published in Journal of materials science. Materials in medicine (2008)
Published in Journal of materials science. Materials in medicine (2008)
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Journal Article
Study of warpage characteristics of molded stacked-die MCP using Shadow Moiré and Micro Moiré techniques
Wang, David W, Hsiang-Ming Huang, Shu-Ching Ho, An-Hong Liu, De-Shin Liu
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
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Conference Proceeding
Effect of bonding temperature on eutectic interconnections in Chip-On-Film packages
De-Shin Liu, Shu-Shen Yeh, Chia-I Tsai, An-Hong Liu, Shu-Ching Ho
Published in 2008 International Conference on Electronic Materials and Packaging (01.10.2008)
Published in 2008 International Conference on Electronic Materials and Packaging (01.10.2008)
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Conference Proceeding
Wafer level glass frit bonding for MEMS hermetic packaging
Jin-Sheng Chang, Jing-Yuan Lin, Shu-Ching Ho, Yao-Jung Lee
Published in 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference (01.10.2010)
Published in 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference (01.10.2010)
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Conference Proceeding
Integration of ZnO-based Gateless Ion-Selective Field-Effect-Transistor pH Sensors
Lee, Ching-Ting, Chiu, Ying-Shuo, Ho, Shu-Ching, Lee, Yao-Jung
Published in Meeting abstracts (Electrochemical Society) (15.02.2012)
Published in Meeting abstracts (Electrochemical Society) (15.02.2012)
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Journal Article
Method for preparing a carbon/carbon composite
Lin, Jiin-Huey Chern, Ju, Chien-Ping, Kuo, Hua-Hsuan, Ho, Shu-Ching, Chen, Seng-Meng
Year of Publication 18.01.2011
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Year of Publication 18.01.2011
Patent
Semiconductor package structure and method for manufacturing the same
Wang, David Wei, Liu, An-Hong, Tsai, Hao-Yin, Huang, Hsiang-Ming, Lee, Yi-Chang, Ho, Shu-Ching
Year of Publication 05.07.2011
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Year of Publication 05.07.2011
Patent
Chip package module
HUANG, HSIANG MING, LIU, AN HONG, HO, SHU CHING, LEE, YI CHANG, TSAI, HAO YIN
Year of Publication 01.07.2015
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Year of Publication 01.07.2015
Patent
Semiconductor package structure and method for manufacturing the same
HUANG, HSIANG MING, LIU, AN HONG, HO, SHU CHING, WANG, DAVID WEI, LEE, YI CHANG, TSAI, HAO YIN
Year of Publication 01.12.2013
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Year of Publication 01.12.2013
Patent
Method of manufacturing semiconductor device
HUANG, HSIANG MING, LIU, AN HONG, HO, SHU CHING, LEE, YI CHANG, TSAI, HAO YIN
Year of Publication 11.07.2013
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Year of Publication 11.07.2013
Patent
Semiconductor package structure with substrate support and the package method thereof
HUANG, HSIANG MING, LIU, AN HONG, HO, SHU CHING, LEE, YI CHANG, TSAI, HAO YIN
Year of Publication 11.07.2013
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Year of Publication 11.07.2013
Patent