Interfacial reaction issues for lead-free electronic solders: Lead-free electronic solders
HO, C. E, YANG, S. C, KAO, C. R
Published in Journal of materials science. Materials in electronics (01.03.2007)
Published in Journal of materials science. Materials in electronics (01.03.2007)
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Journal Article
Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni
HO, C. E, TSAI, R. Y, LIN, Y. L, KAO, C. R
Published in Journal of electronic materials (01.06.2002)
Published in Journal of electronic materials (01.06.2002)
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Journal Article
Influence of Palladium Thickness on the Soldering Reactions Between Sn-3Ag-0.5Cu and Au/Pd(P)/Ni(P) Surface Finish
Wu, W. H., Lin, C. S., Huang, S. H., Ho, C. E.
Published in Journal of electronic materials (01.11.2010)
Published in Journal of electronic materials (01.11.2010)
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Journal Article
Effects of limited Cu supply on soldering reactions between SnAgCu and Ni
HO, C. E, LIN, Y. W, YANG, S. C, KAO, C. R, JIANG, D. S
Published in Journal of electronic materials (01.05.2006)
Published in Journal of electronic materials (01.05.2006)
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Journal Article
Influence of Pd Concentration on the Interfacial Reaction and Mechanical Reliability of the Ni/Sn-Ag-Cu-xPd System
Ho, C. E., Hsu, L. H., Lin, S. W., Rahman, M. A.
Published in Journal of electronic materials (01.01.2012)
Published in Journal of electronic materials (01.01.2012)
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Journal Article
Conference Proceeding
Solid–Solid Reaction Between Sn-3Ag-0.5Cu Alloy and Au/Pd(P)/Ni(P) Metallization Pad with Various Pd(P) Thicknesses
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Journal Article
Conference Proceeding
Pronounced effects of Ni(P) thickness on the interfacial reaction and high impact resistance of the solder/Au/Pd(P)/Ni(P)/Cu reactive system
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Journal Article
Conference Proceeding
Study of DC and AC Electromigration Behavior in Eutectic Pb-Sn Solder Joints
Wu, W. H., Peng, S. P., Lin, C. S., Ho, C. E.
Published in Journal of electronic materials (01.10.2009)
Published in Journal of electronic materials (01.10.2009)
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Journal Article
Comparative study between Sn37Pb and Sn3Ag0.5Cu soldering with Au/Pd/Ni(P) tri-layer structure
Peng, S.P., Wu, W.H., Ho, C.E., Huang, Y.M.
Published in Journal of alloys and compounds (18.03.2010)
Published in Journal of alloys and compounds (18.03.2010)
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Journal Article
Design of solder joints for fundamental studies on the effects of electromigration
HO, C. E, LEE, A, SUBRAMANIAN, K. N
Published in Journal of materials science. Materials in electronics (01.06.2007)
Published in Journal of materials science. Materials in electronics (01.06.2007)
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Journal Article
Microstructure evolution of gold-tin eutectic solder on Cu and Ni substrates
Tsai, J Y, Chang, C W, Ho, C E, Lin, Y L, Kao, C R
Published in Journal of electronic materials (01.01.2006)
Published in Journal of electronic materials (01.01.2006)
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Journal Article
Selective Interfacial Reaction between Ni and Eutectic BiSn Lead-Free Solder
Tao, W. H, Chen, C, Ho, C. E, Chen, W. T, Kao, C. R
Published in Chemistry of materials (01.03.2001)
Published in Chemistry of materials (01.03.2001)
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Journal Article
Cross-interaction between Au and Cu in Au/Sn/Cu ternary diffusion couples
CHANG, C. W, LEE, Q. P, HO, C. E, KAO, C. R
Published in Journal of electronic materials (01.02.2006)
Published in Journal of electronic materials (01.02.2006)
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Journal Article
Reflow soldering and isothermal solid-state aging of Sn-Ag eutectic solder on Au/Ni surface finish
LIU, C. M, HO, C. E, CHEN, W. T, KAO, C. R
Published in Journal of electronic materials (01.09.2001)
Published in Journal of electronic materials (01.09.2001)
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Conference Proceeding
Journal Article
Reliability evaluation on a submicron Ni(P) thin film for lead-free soldering
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Journal Article
Conference Proceeding