Tungsten Contact and Line Resistance Reduction with Advanced Pulsed Nucleation Layer and Low Resistivity Tungsten Treatment
Chandrashekar, Anand, Chen, Feng, Lin, Jasmine, Humayun, Raashina, Wongsenakhum, Panya, Chang, Sean, Danek, Michal, Itou, Takamasa, Nakayama, Tomoo, Kariya, Atsushi, Kawaguchi, Masazumi, Hizume, Shunichi
Published in Japanese Journal of Applied Physics (01.09.2010)
Published in Japanese Journal of Applied Physics (01.09.2010)
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Journal Article
CHEMICAL VAPOR DEPOSITION OF TITANIUM ON A WAFER COMPRISING AN IN-SITU PRECLEANING STEP
WU, LI, VASUDEV, ANAND, JENNINGS, PATRICIA, WU, FREDERICK, C, CHANG, MEI, BOYLE, BRIAN, P, BUCKLEY, LAWRENCE, D., JR, SRINIVAS, RAMANUJAPURAM, A, HIZUME, SHUNICHI
Year of Publication 16.09.1999
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Year of Publication 16.09.1999
Patent
CHEMICAL VAPOR DEPOSITION OF TITANIUM ON A WAFER COMPRISING AN IN-SITU PRECLEANING STEP
WU, LI, VASUDEV, ANAND, JENNINGS, PATRICIA, WU, FREDERICK, C, CHANG, MEI, BOYLE, BRIAN, P, BUCKLEY, LAWRENCE, D., JR, SRINIVAS, RAMANUJAPURAM, A, HIZUME, SHUNICHI
Year of Publication 10.06.1999
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Year of Publication 10.06.1999
Patent