Electrical properties and TDDB performance of Cu interconnects using ALD Ta(Al)N barrier and Ru liner for 7nm node and beyond
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Published in 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) (01.05.2016)
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Conference Proceeding
Journal Article
METHOD FOR PREPARING A SMALL-DIAMETER CHROMATOGRAPHY COLUMN
FUNAKI Masahiro, KAWASAKI Hiroaki, NAKANO Yoshiyuki, MINAKUCHI Kazunobu
Year of Publication 25.08.2016
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Year of Publication 25.08.2016
Patent
METHOD FOR MANUFACTURING SMALL-DIAMETER COLUMN FOR CHROMATOGRAPHY
NAKANO, YOSHIYUKI, KAWASAKI, HIROAKI, MINAKUCHI, KAZUNOBU, FUNAKI, MASAHIRO
Year of Publication 24.08.2016
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Year of Publication 24.08.2016
Patent
Atomic layer deposition of MnOx for Cu capping layer in Cu/low-k interconnects
Kawasaki, Hiroaki, Matsumoto, Kenji, Nagai, Hiroyuki, Kikuchi, Yuuki, Peng Chang
Published in IEEE International Interconnect Technology Conference (01.05.2014)
Published in IEEE International Interconnect Technology Conference (01.05.2014)
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Conference Proceeding