3D Die-to-wafer Cu/Sn Microconnects Formed Simultaneously with an Adhesive Dielectric Bond Using Thermal Compression Bonding
Pozder, Scott, Jain, Ankur, Chatterjee, Ritwik, Huang, Zhihong, Jones, Robert E., Acosta, Eddie, Marlin, Bill, Hillmann, Gerhard, Sobczak, Martin, Kreindl, Gerald, Kanagavel, Senthil, Kostner, Hannes, Pargfrieder, Stefan
Published in 2008 International Interconnect Technology Conference (01.06.2008)
Published in 2008 International Interconnect Technology Conference (01.06.2008)
Get full text
Conference Proceeding
A Numerical Study on Heat Flow and Load Distribution During Chip to Wafer or Wafer to Wafer Bonding in Vacuum
Malecki, K., Pikur, L., Falat, T., Bock, G., Hillmann, G., Sigl, A., Marenco, N., Friedel, K.
Published in 2008 10th Electronics Packaging Technology Conference (01.12.2008)
Published in 2008 10th Electronics Packaging Technology Conference (01.12.2008)
Get full text
Conference Proceeding