Anisotropic Etching of Pyramidal Silica Reliefs with Metal Masks and Hydrofluoric Acid
Kirchner, Robert, Neumann, Volker, Winkler, Felix, Strobel, Carsten, Völkel, Sandra, Hiess, André, Kazazis, Dimitrios, Künzelmann, Ulrich, Bartha, Johann Wolfgang
Published in Small (Weinheim an der Bergstrasse, Germany) (01.10.2020)
Published in Small (Weinheim an der Bergstrasse, Germany) (01.10.2020)
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Journal Article
Atomic layer deposition for high aspect ratio through silicon vias
Knaut, Martin, Junige, Marcel, Neumann, Volker, Wojcik, Henry, Henke, Thomas, Hossbach, Christoph, Hiess, André, Albert, Matthias, Bartha, Johann W.
Published in Microelectronic engineering (01.07.2013)
Published in Microelectronic engineering (01.07.2013)
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Journal Article
Conference Proceeding
TSV Transistor—Vertical Metal Gate FET Inside a Through Silicon VIA
Winkler, Felix, Killge, Sebastian, Fischer, Dustin, Richter, Karola, Hiess, Andre, Bartha, Johann W.
Published in IEEE electron device letters (01.10.2018)
Published in IEEE electron device letters (01.10.2018)
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Journal Article
High Gain Graphene Based Hot Electron Transistor with Record High Saturated Output Current Density
Strobel, Carsten, Chavarin, Carlos A., Knaut, Martin, Völkel, Sandra, Albert, Matthias, Hiess, Andre, Max, Benjamin, Wenger, Christian, Kirchner, Robert, Mikolajick, Thomas
Published in Advanced electronic materials (01.02.2024)
Published in Advanced electronic materials (01.02.2024)
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Journal Article
Plasma Etching of Tapered Features in Silicon for MEMS and Wafer Level Packaging Applications
Ngo, Ha-Duong, Hiess, Andre, Seidemann, Volker, Studzinski, Daniel, Lange, Martin, Leib, Jürgen, Shariff, Dzafir, Ashraf, Huma, Steel, Mike, Atabo, Lilian, Reast, Jon
Published in Journal of physics. Conference series (01.04.2006)
Published in Journal of physics. Conference series (01.04.2006)
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Journal Article
Enhanced Electrical Properties of Optimized Vertical Graphene-Base Hot Electron Transistors
Strobel, Carsten, Chavarin, Carlos A., Völkel, Sandra, Jahn, Andreas, Hiess, Andre, Knaut, Martin, Albert, Matthias, Wenger, Christian, Steinke, Olaff, Stephan, Ulf, Röhlecke, Sören, Mikolajick, Thomas
Published in ACS applied electronic materials (28.03.2023)
Published in ACS applied electronic materials (28.03.2023)
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Journal Article
Plasma etching of tapered structures
HIESS, ANDRE, LANGE, MARTIN, STUDZINSKI, DANIEL, NGO, HA-DUONG, SEIDEMANN, VOLKER
Year of Publication 04.03.2009
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Year of Publication 04.03.2009
Patent
Plasma etching of tapered structures
NGO HA DUONG,SEIDEMANN VOLKER,STUDZINSKI DANIEL,LANGE MARTIN,HIESS ANDRE
Year of Publication 15.08.2007
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Year of Publication 15.08.2007
Patent
PLASMA ETCHING WITH TAPERED STRUCTURE
STUDZINSKI DANIEL, NGO HA-DUONG, SEIDEMANN VOLKER, LANGE MARTIN, HIESS ANDRE
Year of Publication 07.06.2007
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Year of Publication 07.06.2007
Patent
PLASMA ETCHING OF TAPERED STRUCTURES
STUDZINSKI DANIEL, NGO HA DUONG, SEIDEMANN VOLKER, LANGE MARTIN, HIESS ANDRE
Year of Publication 18.05.2007
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Year of Publication 18.05.2007
Patent
Plasma etching of tapered structures
STUDZINSKI DANIEL, NGO HA-DUONG, SEIDEMANN VOLKER, LANGE MARTIN, HIESS ANDRE
Year of Publication 17.05.2007
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Year of Publication 17.05.2007
Patent
Plasma etching of tapered structures
HIESS, ANDRE, LANGE, MARTIN, STUDZINSKI, DANIEL, NGO, HA-DUONG, SEIDEMANN, VOLKER
Year of Publication 16.05.2007
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Year of Publication 16.05.2007
Patent
Plasma etching of tapered structures
HIESS, ANDRE, LANGE, MARTIN, STUDZINSKI, DANIEL, NGO, HA-DUONG, SEIDEMANN, VOLKER
Year of Publication 16.05.2007
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Year of Publication 16.05.2007
Patent