3-D Sequential Stacked Planar Devices Featuring Low-Temperature Replacement Metal Gate Junctionless Top Devices With Improved Reliability
Vandooren, A., Franco, J., Parvais, B., Wu, Z., Witters, L., Walke, A., Li, W., Peng, L., Deshpande, V., Bufler, F. M., Rassoul, N., Hellings, G., Jamieson, G., Inoue, F., Verbinnen, G., Devriendt, K., Teugels, L., Heylen, N., Vecchio, E., Zheng, T., Rosseel, E., Vanherle, W., Hikavyy, A., Chan, B. T., Ritzenthaler, R., Besnard, G., Schwarzenbach, W., Gaudin, G., Radu, I., Nguyen, B.-Y., Waldron, N., De Heyn, V., Mocuta, D., Collaert, N.
Published in IEEE transactions on electron devices (01.11.2018)
Published in IEEE transactions on electron devices (01.11.2018)
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Barrier and seed repair performance of thin RuTa films for Cu interconnects
Volders, H., Carbonell, L., Heylen, N., Kellens, K., Zhao, C., Marrant, K., Faelens, G., Conard, T., Parmentier, B., Steenbergen, J., Peer, M. Van de, Wilson, C.J., Sleeckx, E., Beyer, G.P., Tőkei, Zs, Gravey, V., Shah, K., Cockburn, A.
Published in Microelectronic engineering (01.05.2011)
Published in Microelectronic engineering (01.05.2011)
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Surface properties restoration and passivation of high porosity ultra low- k dielectric ( k ∼ 2.3) after direct-CMP
Sinapi, F., Heylen, N., Travaly, Y., Vereecke, G., Baklanov, M., Kesters, E., Van Hoeymissen, J., Hernandèz, J.L., Beyer, G., Fischer, P.
Published in Microelectronic engineering (01.11.2007)
Published in Microelectronic engineering (01.11.2007)
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In-line Small-Spot X-Ray Fluorescence Assessment of Electroplating and Chemical Mechanical Polishing
Gueneau de Mussy, J.-P., Bottiglieri, G., Heylen, N., Carbonell, L., O’Dell, J., Agnihotri, D. K., Tokar, A., Mazor, I.
Published in Journal of the Electrochemical Society (2006)
Published in Journal of the Electrochemical Society (2006)
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Buried Power Rail Metal exploration towards the 1 nm Node
Gupta, A., Radisic, D., Maes, J. W., Pedreira, O. Varela, Soulie, J-P., Jourdan, N., Mertens, H., Bandyopadhyay, S., Le, Q. T., Pacco, A., Heylen, N., Vandersmissen, K., Devriendt, K., Zhu, C., Datta, S., Sebaai, F., Wang, S., Mousa, M., Lee, J., Geypen, J., De Wachter, B., Chehab, B., Salahuddin, S. M., Murdoch, G., Biesemans, S., Tokei, Zs, Litta, E. Dentoni, Horiguchi, N.
Published in 2021 IEEE International Electron Devices Meeting (IEDM) (11.12.2021)
Published in 2021 IEEE International Electron Devices Meeting (IEDM) (11.12.2021)
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P15-22 Particle-induced systemic autoimmune features in C57BL/6J and NOD/ShiLtJ mice
Lemaire, F., Janssen, L., Marain, N., Heylen, N., Koshy, P., Vanstapel, A., Ronsmans, S., Ghosh, M., Hoet, P.
Published in Toxicology letters (01.09.2024)
Published in Toxicology letters (01.09.2024)
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Low temperature source/drain epitaxy and functional silicides: essentials for ultimate contact scaling
Porret, C., Everaert, J.-L., Schaekers, M., Ragnarsson, L.-A., Hikavyy, A., Rosseel, E., Rengo, G., Loo, R., Khazaka, R., Givens, M., Piao, X., Mertens, S., Heylen, N., Mertens, H., De Carvalho Cavalcante, C. Toledo, Sterckx, G., Brus, S., Mehta, A. Nalin, Korytov, M., Batuk, D., Favia, P., Langer, R., Pourtois, G., Swerts, J., Litta, E. Dentoni, Horiguchi, N.
Published in 2022 International Electron Devices Meeting (IEDM) (03.12.2022)
Published in 2022 International Electron Devices Meeting (IEDM) (03.12.2022)
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Impact of thinning and through silicon via proximity on High-k / Metal Gate first CMOS performance
Mercha, A, Redolfi, A, Stucchi, M, Minas, N, Van Olmen, J, Thangaraju, S, Velenis, D, Domae, S, Yang, Y, Katti, G, Labie, R, Okoro, C, Zhao, M, Asimakopoulos, P, De Wolf, I, Chiarella, T, Schram, T, Rohr, E, Van Ammel, A, Jourdain, A, Ruythooren, W, Armini, S, Radisic, A, Philipsen, H, Heylen, N, Kostermans, M, Jaenen, P, Sleeckx, E, Sabuncuoglu Tezcan, D, Debusschere, I, Soussan, P, Perry, D, Van der Plas, G, Cho, J H, Marchal, P, Travaly, Y, Beyne, E, Biesemans, S, Swinnen, B
Published in 2010 Symposium on VLSI Technology (01.06.2010)
Published in 2010 Symposium on VLSI Technology (01.06.2010)
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Exploring W-Cu hybrid dual damascene metallization for future nodes
van der Veen, Marleen H., Pedreira, O. Varela, Heylen, N., Jourdan, N., Lariviere, S., Park, S., Struyf, H., Tokei, Zs, Lei, W., Pethe, S., Hwang, S., Chen, F., Wu, Z., Machillot, J., Cockburn, A., Jansen, A.
Published in 2021 IEEE International Interconnect Technology Conference (IITC) (06.07.2021)
Published in 2021 IEEE International Interconnect Technology Conference (IITC) (06.07.2021)
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Conference Proceeding
Barrier/liner stacks for scaling the Cu interconnect metallization
van der Veen, Marleen H., Jourdan, N., Gonzalez, V. Vega, Wilson, C. J., Heylen, N., Pedreira, O. Varela, Struyf, H., Croes, K., Bommels, J., Tokei, Zs
Published in 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) (01.05.2016)
Published in 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) (01.05.2016)
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Journal Article
Buried Power Rail Scaling and Metal Assessment for the 3 nm Node and Beyond
Gupta, A., Pedreira, O. Varela, Tao, Z., Mertens, H., Radisic, D., Jourdan, N., Devriendt, K., Heylen, N., Wang, S., Chehab, B., Jang, D., Hellings, G., Sebaai, F., Lorant, C., Teugels, L., Peter, A., Chan, BT, Schleicher, F., Demonie, I., Marien, P., Sepulveda, A., Richard, O., Nagesh, N., Lesniewska, A., Lazzarino, F., Ryckaert, J., Morin, P., Altamirano-Sanchez, E., Murdoch, G., Bommels, J., Demuynck, S., Na, M. H, Tokei, Z., Biesemans, S., Litta, E. Dentoni, Horiguchi, N.
Published in 2020 IEEE International Electron Devices Meeting (IEDM) (12.12.2020)
Published in 2020 IEEE International Electron Devices Meeting (IEDM) (12.12.2020)
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Conference Proceeding
Inflection points in interconnect research and trends for 2nm and beyond in order to solve the RC bottleneck
Tokei, Zs, Vega, V., Murdoch, G., O'Toole, M., Croes, K., Baert, R., Veen, M. Van der, Adelmann, C., Soulie, J. P., Boemmels, J., Wilson, C., Park, S. H., Sankaran, K., Pourtois, G., Sweerts, J., Paolillo, S., Decoster, S., Mao, M., Lazzarino, F., Versluijs, J., Blanco, V., Ercken, M., Kesters, E., Le, Q-T., Holsteyns, F., Heylen, N., Teugels, L., Devriendt, K., Struyf, H., Morin, P., Jourdan, N., Elshocht, S. Van, Ciofi, I., Gupta, A., Zahedmanesh, H., Vanstreels, K., Na, M. H.
Published in 2020 IEEE International Electron Devices Meeting (IEDM) (12.12.2020)
Published in 2020 IEEE International Electron Devices Meeting (IEDM) (12.12.2020)
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90nm W\Al2O3\TiW\Cu 1T1R CBRAM cell showing low-power, fast and disturb-free operation
Belmonte, A., Kim, W., Chan, Bt, Heylen, N., Fantini, A., Houssa, M., Jurczak, M., Goux, L.
Published in 2013 5th IEEE International Memory Workshop (01.05.2013)
Published in 2013 5th IEEE International Memory Workshop (01.05.2013)
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Effect of MRC-5 fibroblast conditioned medium on breast cancer cell motility and invasion in vitro
Heylen, N, Baurain, R, Remacle, C, Trouet, A
Published in Clinical & experimental metastasis (01.02.1998)
Published in Clinical & experimental metastasis (01.02.1998)
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Three-Layer BEOL Process Integration with Supervia and Self-Aligned-Block Options for the 3 nm Node
Vega-Gonzalez, V., Bekaert, J., Kesters, E., Le, Q. T., Lorant, C., Varela P., O., Teugels, L., Heylen, N., El-Mekki, Z., van der Veen, M., Webers, T., Wilson, C. J., Vats, H., Rynders, L., Cupak, M., Uk-Lee, J., Drissi, Y., Halipre, L., Charley, A.-L., Verdonck, P., Witters, T., Gompel, S. V., Briggs, B., Kimura, Y., Jourdan, N., Ciofi, I., Gupta, A., Contino, A., Boccardi, G., Lariviere, S., Dupas, L., De-Wachter, B., Vancoille, E., Decoster, S., Lazzarino, F., Ercken, M, Debacker, P., Kim, R., Trivkovic, D., Croes, K., Leray, P., Dillemans, L., Chen, Y.-F., Tokei, Z., Versluijs, J., Lesniewska, A., Paolillo, S., Baert, R., Puliyalil, H.
Published in 2019 IEEE International Electron Devices Meeting (IEDM) (01.12.2019)
Published in 2019 IEEE International Electron Devices Meeting (IEDM) (01.12.2019)
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A new dummy-free shallow trench isolation concept for mixed-signal applications
BADENES, G, ROOYACKERS, R, AUGENDRE, E, VANDAMME, E, PERELLO, C, HEYLEN, N, GRILLAERT, J, DEFERM, L
Published in Journal of the Electrochemical Society (01.10.2000)
Published in Journal of the Electrochemical Society (01.10.2000)
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Process Integration of High Aspect Ratio Vias with a Comparison between Co and Ru Metallizations
Vega-Gonzalez, V., Montero, D., Versluijs, J., Pedreira, O. Varela, Jourdan, N., Puliyalil, H., Chehab, B., Peissker, T., Haider, A., Batuk, D., Martinez, G. T., Geypen, J., Le, Q. T., Bazzazian, N., Heylen, N., van der Veen, M., El-Mekki, Z., Webers, T., Vats, H., Rynders, L., Cupak, M., Uk-Lee, J., Drissi, Y., Halipre, L., Gillijns, W., Charley, A.-L., Verdonck, P., Witters, T., Gompel, S. V., Kimura, Y., Ciofi, I., De Wachter, B., Swerts, J., Grieten, E., Ercken, M., Kim, R., Croes, K., Leray, P., Jaysankar, M., Nagesh, N., Ramakers, L., Murdoch, G., Park, S., Tokei, Z., Dentoni-Litta, E., Horiguchi, N.
Published in 2021 IEEE International Interconnect Technology Conference (IITC) (06.07.2021)
Published in 2021 IEEE International Interconnect Technology Conference (IITC) (06.07.2021)
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Novell embedded microbump approach for die-to-die and wafer-to-wafer interconnects with variable microbump diameters and down to 5 um interconnect pitch scaling
Derakhshandeh, J., Beyne, E., Capuz, G., Inoue, F., Cherman, V., De Preter, I., Duval, F., Slabbekoorn, J., Gerets, C., Heyvaert, C., Beirnaert, F., Cochet, T., Bex, P., Hou, L., Lofrano, M., Jamieson, G., Heylen, N., Suhard, S., Honore, M., Webers, T., Bertheau, J., Phommahaxay, A., Van der Plas, G., Rebibis, K. J., Miller, A., Beyer, G.
Published in 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) (01.09.2019)
Published in 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) (01.09.2019)
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