Interfacial reaction and solder joint reliability of Pb-free solders in lead frame chip scale packages (LF-CSP)
Yoon, Seung Wook, Park, Chang Jun, Hong, Sung Hak, Moon, Jong Tae, Park, Ik Seong, Chun, Heung Sup
Published in Journal of electronic materials (01.10.2000)
Published in Journal of electronic materials (01.10.2000)
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Journal Article
Pico-second signal transient characterization technique of meanders through s-parameter measurement in high-speed PWB interconnects
Yong-Ju Kim, Jo-Han Kim, Hyo-Seog Ryu, Young-Suk Suh, Jae-Kyung Wee, Heung-Sup Chun, Joong-Sik Ki
Published in 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) (2001)
Published in 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) (2001)
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Conference Proceeding
Microwave frequency model of wafer level package and increased loading effect on Rambus memory module
Junwoo Lee, Baekkyu Choi, Seungyoung Ahn, Woonghwan Ryu, Jae Myun Kim, Kwang Seong Choi, Joon-Ki Hong, Heung-Sup Chun, Kim, Joungho
Published in 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) (2001)
Published in 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) (2001)
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Conference Proceeding