Fabrication, packaging, and characterization of p-SOI Wheatstone bridges for harsh environments
Kähler, J., Stranz, A., Doering, L., Merzsch, S., Heuck, N., Waag, A., Peiner, E.
Published in Microsystem technologies (01.08.2012)
Published in Microsystem technologies (01.08.2012)
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Journal Article
Conference Proceeding
Lifetime analysis of power modules with new packaging technologies
Heuck, N., Bayerer, R., Krasel, S., Otto, F., Speckels, R., Guth, K.
Published in 2015 IEEE 27th International Symposium on Power Semiconductor Devices & IC's (ISPSD) (01.05.2015)
Published in 2015 IEEE 27th International Symposium on Power Semiconductor Devices & IC's (ISPSD) (01.05.2015)
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Conference Proceeding
Sintering of Copper Particles for Die Attach
Kahler, J., Heuck, N., Wagner, A., Stranz, A., Peiner, E., Waag, A.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.10.2012)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.10.2012)
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Journal Article
Pick-and-Place Silver Sintering Die Attach of Small-Area Chips
Kahler, J., Heuck, N., Stranz, A., Waag, A., Peiner, E.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.02.2012)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.02.2012)
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Journal Article
Analysis and Modeling of Thermomechanically Improved Silver-Sintered Die-Attach Layers Modified by Additives
Heuck, N., Langer, A., Stranz, A., Palm, G., Sittig, R., Bakin, A., Waag, A.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.11.2011)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.11.2011)
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Journal Article
New assembly and interconnect technologies for power modules
Guth, K., Oeschler, N., Boewer, L., Speckels, R., Strotmann, G., Heuck, N., Krasel, S., Ciliox, A.
Published in 2012 7th International Conference on Integrated Power Electronics Systems (CIPS) (01.03.2012)
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Published in 2012 7th International Conference on Integrated Power Electronics Systems (CIPS) (01.03.2012)
Conference Proceeding
Low-pressure sintering of silver micro- and nanoparticles for a high temperature stable pick & place die attach
Kahler, J., Heuck, N., Palm, G., Stranz, A., Waag, A., Peiner, E.
Published in 18th European Microelectronics & Packaging Conference (01.09.2011)
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Published in 18th European Microelectronics & Packaging Conference (01.09.2011)
Conference Proceeding
Die-attach for high-temperature applications using fineplacer-pressure-sintering (FPS)
Kahler, J, Heuck, N, Palm, G, Stranz, A, Waag, A, Peiner, E
Published in 3rd Electronics System Integration Technology Conference ESTC (01.09.2010)
Published in 3rd Electronics System Integration Technology Conference ESTC (01.09.2010)
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Conference Proceeding