Development of adhesion promoters to enhance polymer/substrate interface toughness
Im, J., Stokich, T., Hetzner, J., Buske, G., Curphy, J., Shaffer, E.O., Meyers, G.
Published in Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405) (1999)
Published in Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405) (1999)
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Conference Proceeding
Underfill adhesion to BCB (Cyclotene/sup TM/) bumping and redistribution dielectrics
Garrou, P., Scheck, D., Jang-Hi Im, Hetzner, J., Meyers, G., Hawn, D., Jiali Wu, Vincent, M.B., Wong, C.P.
Published in IEEE transactions on advanced packaging (01.08.2000)
Published in IEEE transactions on advanced packaging (01.08.2000)
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Journal Article
Integration of a low permittivity spin-on embedded hardmask for Cu/SiLK resin dual damascene
Waeterloos, J.J., Shaffer, E.O., Stokich, T., Hetzner, J., Price, D., Booms, L., Donaton, R.A., Beyer, G., Coenegrachts, B., Caluwaerts, R., Struyf, H., Tokei, Z.S., Vervoort, I., Sijmus, B., Vos, I., Maex, K., Komiya, T., Iwashita, M.
Published in Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461) (2001)
Published in Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461) (2001)
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Conference Proceeding
Aqueous-Base-Developable Benzocyclobutene (BCB)-Based Material Curable in Air
So, Ying-hung, Topper, Michael, Baumgartner, T., Stark, Edmund J., Li, Yongfu, Kisting, Scott, Achen, Albert, Baranek, Kayla, Scheck, Daniel, Hetzner, Jack, Folkenroth, Jason J.
Published in IEEE transactions on advanced packaging (01.11.2006)
Published in IEEE transactions on advanced packaging (01.11.2006)
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Journal Article
Aqueous-Base-Developable Benzocyclobutene (BCB)-Based Material Curable in Air
Ying-Hung So, Stark, E., Yongfu Li, Stokich, T., Ober, K., Achen, A., Scheck, D., Kisting, S., Hetzner, J., Baranek, K., Curphy, J., Thurston, S., Beach, E., Folkenroth, J., Richardson, T., Rozeveld, S.
Published in Proceedings Electronic Components and Technology, 2005. ECTC '05 (2005)
Published in Proceedings Electronic Components and Technology, 2005. ECTC '05 (2005)
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Conference Proceeding
A novel positive-tone and aqueous-base-developable photosensitive benzocyclobutene-based material for microelectronics
Ying-Hung So, Stark, E., Thurston, S., Stokich, T., Yongfu Li, Achen, A., Hetzner, J., Jang-Hi Im, Curphy, J., Gavit, G., Beach, E., Folkenroth, J., Chakrabarti, A., Hawn, D., Mecca, S., de Biaugue, C.C.
Published in Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) (2004)
Published in Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) (2004)
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Conference Proceeding
High-Throughput Analysis in Catalysis Research Using Novel Approaches to Transmission Infrared Spectroscopy
Leugers, Anne, Neithamer, David R, Sun, Larry S, Hetzner, Jack E, Hilty, Sean, Hong, Sam, Krause, Matthew, Beyerlein, Kenneth
Published in Journal of combinatorial chemistry (01.05.2003)
Published in Journal of combinatorial chemistry (01.05.2003)
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Journal Article