by Bliss, D. W., Ajayi, T., Akoglu, A., Aliyev, I., Basaklar, T., Belayneh, L., Blaauw, D., Brunhaver, J., Chakrabarti, C., Chang, L., Chen, K.-Y., Chen, M.-H., Chen, X., Chiriyath, A. R., Daftardar, A., Dreslinski, R., Dutta, A., Farcas, A. J., Fu, Y., Goksoy, A., He, X., Hassan, Md. S., Herschfelt, A., Holtom, J., Kim, H.-S., Krishnakumar, A. N., Li, Y., Ma, O., Mack, J., Mallik, S., Mandal, S. K., Marculescu, R., McCall, B., Mudge, T., Ogras, U. Y., Pandey, V., Siddiqui, S., Sun, Y.-H., Venkataramani, A., Wei, X., Willis, B. R., Yu, H., Yue, Y.
Published in 2022 IEEE International Symposium on Circuits and Systems (ISCAS) (28.05.2022)