Corrigendum to “Critical view of the results of the 2nd international round-robin test on EIS measurements of organic coatings” [Prog. Org. Coatings 180 (2023) 107565]
Bakalli, Mirdash, Keil, Patrick, Strunz, Werner, Broeker, Thomas, Herrmann, Rainer, Vogelsang, Joerg
Published in Progress in organic coatings (01.09.2023)
Published in Progress in organic coatings (01.09.2023)
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Journal Article
Carrier substrate for electrical components and Process for producing a carrier substrate
BRITTING STEFAN, GIL VITALIJ, HERRMANN RAINER, MEYER ANDREAS, MULLER LASZLO
Year of Publication 18.02.2022
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Year of Publication 18.02.2022
Patent
금속-세라믹 기판, 금속-세라믹 기판 냉각 시스템 및 상기 시스템 제조 방법
BRITTING STEFAN, GIL VITALIJ, HERRMANN RAINER, MEYER ANDREAS, MULLER LASZLO
Year of Publication 14.12.2020
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Year of Publication 14.12.2020
Patent
세라믹으로 제조된 캐리어 층에 바이어를 형성하는 방법 및 이러한 바이어를 가진 캐리어 층
REGER MARTIN, BRITTING STEFAN, HERRMANN RAINER, SCHMIDT KARSTEN, MEYER ANDREAS
Year of Publication 02.03.2020
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Year of Publication 02.03.2020
Patent
전기 요소용 캐리어 기판 및 캐리어 기판의 제조 방법
BRITTING STEFAN, GIL VITALIJ, HERRMANN RAINER, MEYER ANDREAS, MULLER LASZLO
Year of Publication 23.08.2019
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Year of Publication 23.08.2019
Patent
How Can We Gain Trust in EIS Measurements on High Impedance Systems?
Vogelsang, Joerg, Bakalli, Mirdash, Keil, Patrick, Broeker, Thomas, Herrmann, Rainer, Strunz, Werner
Published in 2023 International Workshop on Impedance Spectroscopy (IWIS) (26.09.2023)
Published in 2023 International Workshop on Impedance Spectroscopy (IWIS) (26.09.2023)
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Conference Proceeding
CARRIER SUBSTRATE FOR ELECTRIC COMPONENTS AND MANUFACTURING METHOD FOR CARRIER SUBSTRATE
BRITTING, Stefan, MÜLLER, László, HERRMANN, Rainer, MEYER, Andreas, GIL, Vitalij
Year of Publication 23.08.2023
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Year of Publication 23.08.2023
Patent
METHOD FOR PRODUCING A VIA IN A CARRIER LAYER PRODUCED FROM A CERAMIC AND CARRIER LAYER HAVING A VIA
Reger, Martin, Britting, Stefan, Meyer, Andreas, Schmidt, Karsten, Herrmann, Rainer
Year of Publication 04.05.2023
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Year of Publication 04.05.2023
Patent
Carrier substrate with a thick metal interlayer and a cooling structure
Müller, László, Britting, Stefan, Meyer, Andreas, Gil, Vitalij, Herrmann, Rainer
Year of Publication 24.01.2023
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Year of Publication 24.01.2023
Patent
METHOD FOR PRODUCING A VIA IN A CARRIER LAYER PRODUCED FROM A CERAMIC AND CARRIER LAYER HAVING A VIA
Britting, Stefan, REGER, Martin, HERRMANN, Rainer, MEYER, Andreas, SCHMIDT, Karsten
Year of Publication 28.01.2022
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Year of Publication 28.01.2022
Patent
METHOD FOR PRODUCING A VIA IN A CARRIER LAYER PRODUCED FROM A CERAMIC AND CARRIER LAYER HAVING A VIA
BRITTING, Stefan, REGER, Martin, HERRMANN, Rainer, MEYER, Andreas, SCHMIDT, Karsten
Year of Publication 14.07.2021
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Year of Publication 14.07.2021
Patent