Efficient and flexible Focused Ion Beam micromachining of Solid Immersion Lenses in various bulk semiconductor materials – An adaptive calibration algorithm
Scholz, P., Herfurth, N., Sadowski, M., Lundquist, T., Kerst, U., Boit, C.
Published in Microelectronics and reliability (01.09.2014)
Published in Microelectronics and reliability (01.09.2014)
Get full text
Journal Article
Conference Proceeding
The IC Ultra-Thin Back Surface - A Field of Real Nanoscale Fault Isolation Opportunities Requiring a Skillful Sample Preparation
Boit, C., Jatzkowski, J., Altmann, F., DiBattista, M., Silverman, S., Zwicker, G., Herfurth, N., Amini, E., Seifert, J.-P.
Published in 2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (18.07.2022)
Published in 2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (18.07.2022)
Get full text
Conference Proceeding
Comprehensive parametric investigations of EOFM measurements on single FinFET transistors
Beyreuther, A., Herfurth, N., Amini, E., Nakamura, T., Motamedi, B., Boit, C.
Published in 2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (20.07.2020)
Published in 2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (20.07.2020)
Get full text
Conference Proceeding
EOFM for contactless parameter extraction of low k dielectric MIS structures
Herfurth, N., Amini, E., Beyreuther, A., Nakamura, T., Keil, S., Boit, C.
Published in 2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA) (01.07.2019)
Published in 2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA) (01.07.2019)
Get full text
Conference Proceeding
Adhesive-free bonding for hetero-integration of InP based coupons micro-transfer printed on SiO2 into Complementary Metal-Oxide-Semiconductor backend for Si photonics application on 8″ wafer platform
Anand, K., Steglich, P., Kreissl, J., Chavarin, C.A., Spirito, D., Franck, M., Lecci, G., Costina, I., Herfurth, N., Katzer, J., Mai, C., Becker, A., Reithmaier, J.P., Zimmermann, L., Mai, A.
Published in Thin solid films (30.06.2024)
Published in Thin solid films (30.06.2024)
Get full text
Journal Article
EOFM measurements of lateral and vertical Bipolar Transistors in Silicon and SiGe:C Technologies
Beyreuther, A., Herfurth, N., Amini, E., Nakamura, T., Fischer, G. G., Keil, S., Boit, C.
Published in 2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA) (01.07.2019)
Published in 2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA) (01.07.2019)
Get full text
Conference Proceeding
IC security and quality improvement by protection of chip backside against hardware attacks
Amini, E., Beyreuther, A., Herfurth, N., Steigert, A., Muydinov, R., Szyszka, B., Boit, C.
Published in Microelectronics and reliability (01.09.2018)
Published in Microelectronics and reliability (01.09.2018)
Get full text
Journal Article
Photon emission as a characterization tool for bipolar parasitics in FinFET technology
Beyreuther, A., Herfurth, N., Amini, E., Nakamura, T., De Wolf, I., Boit, C.
Published in Microelectronics and reliability (01.09.2018)
Published in Microelectronics and reliability (01.09.2018)
Get full text
Journal Article
Non-invasive soft breakdown localisation in low k dielectrics using photon emission microscopy and thermal laser stimulation
Herfurth, N., Wu, C., Beyreuther, A., Nakamura, T., De Wolf, I., Simon-Najasek, M., Altmann, F., Croes, K., Boit, C.
Published in Microelectronics and reliability (01.01.2019)
Published in Microelectronics and reliability (01.01.2019)
Get full text
Journal Article
New Access to Soft Breakdown Parameters of Low-k Dielectrics Through Localisation-Based Analysis
Herfurth, N., Beyreuther, A., Amini, E., Boit, C., Simon-Najasek, M., Hubner, S., Altmann, F., Herfurth, R., Wu, C., De Wolf, I., Croes, K.
Published in 2019 IEEE International Reliability Physics Symposium (IRPS) (01.03.2019)
Published in 2019 IEEE International Reliability Physics Symposium (IRPS) (01.03.2019)
Get full text
Conference Proceeding
Contactless Fault Isolation of Ultra Low k Dielectrics in Soft Breakdown Condition
Herfurth, N., Wu, C., Nakamura, T., Wolf, I.De, Croes, K., Boit, C.
Published in 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (01.07.2018)
Published in 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (01.07.2018)
Get full text
Conference Proceeding
Exploring the Student Perspective: Assessing Technology Readiness and Acceptance for Adopting Large Language Models in Higher Education
Lemke, Claudia, Kirchner, Kathrin, Anandarajah, Liadan, Herfurth, Florian N
Published in European Conference on e-Learning (19.10.2023)
Published in European Conference on e-Learning (19.10.2023)
Get full text
Conference Proceeding