Experimental Observations of Stress-Driven Grain Boundary Migration
Rupert, T.J, Gianola, D.S, Gan, Y, Hemker, K.J
Published in Science (American Association for the Advancement of Science) (18.12.2009)
Published in Science (American Association for the Advancement of Science) (18.12.2009)
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Journal Article
Microstructural Characterization of Commercial Hot-Pressed Boron Carbide Ceramics
Chen, M. W., McCauley, J. W., LaSalvia, J. C., Hemker, K. J.
Published in Journal of the American Ceramic Society (01.07.2005)
Published in Journal of the American Ceramic Society (01.07.2005)
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Journal Article
Incipient deformation twinning in dynamically sheared bcc tantalum
Chen, C.Q., Florando, J.N., Kumar, M., Ramesh, K.T., Hemker, K.J.
Published in Acta materialia (01.05.2014)
Published in Acta materialia (01.05.2014)
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Journal Article
Characterizing the microstructure and mechanical behavior of a two-phase NiCoCrAlY bond coat for thermal barrier systems
Hemker, K.J., Mendis, B.G., Eberl, C.
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (15.06.2008)
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (15.06.2008)
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Journal Article
Conference Proceeding
Increased strain rate sensitivity due to stress-coupled grain growth in nanocrystalline Al
Gianola, D.S., Warner, D.H., Molinari, J.F., Hemker, K.J.
Published in Scripta materialia (01.10.2006)
Published in Scripta materialia (01.10.2006)
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Journal Article
Grain-size stabilization by impurities and effect on stress-coupled grain growth in nanocrystalline Al thin films
Gianola, D.S., Mendis, B.G., Cheng, X.M., Hemker, K.J.
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (15.06.2008)
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (15.06.2008)
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Journal Article
Conference Proceeding
Microsample tensile testing of nanocrystalline copper
Wang, Y.M., Wang, K., Pan, D., Lu, K., Hemker, K.J., Ma, E.
Published in Scripta materialia (01.06.2003)
Published in Scripta materialia (01.06.2003)
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Journal Article
Measured mechanical properties of LIGA Ni structures
Cho, H.S., Hemker, K.J., Lian, K., Goettert, J., Dirras, G.
Published in Sensors and actuators. A, Physical (15.01.2003)
Published in Sensors and actuators. A, Physical (15.01.2003)
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Journal Article
Conference Proceeding
Microsample tensile testing of LIGA nickel for MEMS applications
Hemker, K.J, Last, H
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (01.12.2001)
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (01.12.2001)
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Journal Article
Conference Proceeding
Microstructural observations of as-prepared and thermal cycled NiCoCrAlY bond coats
Mendis, B.G., Tryon, B., Pollock, T.M., Hemker, K.J.
Published in Surface & coatings technology (20.12.2006)
Published in Surface & coatings technology (20.12.2006)
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Journal Article
Conference Proceeding
The high-strain-rate response of alpha-titanium: experiments, deformation mechanisms and modeling
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Journal Article
Conference Proceeding
Use of the Nye tensor in analyzing HREM images of bcc screw dislocations
Mendis, B. G., Mishin, Y., Hartley, C. S., Hemker, K. J.
Published in Philosophical magazine (Abingdon, England) (11.10.2006)
Published in Philosophical magazine (Abingdon, England) (11.10.2006)
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Journal Article
Thermal stability of electrodeposited LIGA Ni–W alloys for high temperature MEMS applications
Haj-Taieb, M., Haseeb, A. S. M. A., Caulfield, J., Bade, K., Aktaa, J., Hemker, K. J.
Published in Microsystem technologies (01.10.2008)
Published in Microsystem technologies (01.10.2008)
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Journal Article
Conference Proceeding
Microstructural evolution in passivated Al films on Si substrates during thermal cycling
Legros, M., Hemker, K.J., Gouldstone, A., Suresh, S., Keller-Flaig, R.-M., Arzt, E.
Published in Acta materialia (01.08.2002)
Published in Acta materialia (01.08.2002)
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