Demystifying Machine Learning for Signal and Power Integrity Problems in Packaging
Swaminathan, Madhavan, Torun, Hakki Mert, Yu, Huan, Hejase, Jose Ale, Becker, Wiren Dale
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.08.2020)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.08.2020)
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Journal Article
Nonlinear Eddy Current Technique for Characterizing Case Hardening Profiles
Chan, Shiu Chuen, Grimberg, Raimond, Hejase, Jose A., Zeng, Zhiwei, Lekeakatakunju, Peter, Udpa, Lalita, Udpa, Satish S.
Published in IEEE transactions on magnetics (01.06.2010)
Published in IEEE transactions on magnetics (01.06.2010)
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Journal Article
Conference Proceeding
Renal Echinococcosis mistaken for a cystic renal tumor: A case report
Ghandour, Richard, Nassar, Georges, Hejase, Mohamed Jose
Published in Urology case reports (01.01.2020)
Published in Urology case reports (01.01.2020)
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Journal Article
Effect of Curvature on the Performance of a Cylindrically-Conformal Cavity-Backed E-patch Antenna
Gardner, Chad M, Rothwell, Edward J, Kempel, Leo C, Hejase, Jose A, Ouedraogo, Raoul O, Schneider, Stephen W
Published in Applied Computational Electromagnetics Society journal (2011)
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Published in Applied Computational Electromagnetics Society journal (2011)
Journal Article
Far End Crosstalk Mitigation of Differential High Speed Interconnects Within Printed Circuit Board Via Fields
Tang, Junyan, Yang, Xianbo, Hejase, Jose A., Bohra, Mahesh, Zhang, Yanyan, Duan, Xiaomin, Kaller, Dierk, Becker, Wiren D., Dreps, Daniel M.
Published in 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (17.10.2021)
Published in 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (17.10.2021)
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Conference Proceeding
RX Equalization for a High-Speed Channel based on Bayesian Active Learning using Dropout
Yang, Xianbo, Tang, Junyan, Torun, Hakki M., Becker, Wiren D., Hejase, Jose A., Swaminathan, Madhavan
Published in 2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (01.10.2020)
Published in 2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (01.10.2020)
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Conference Proceeding
Parallel Bayesian Active Learning using Dropout for Optimizing High-Speed Channel Equalization
Yang, Xianbo, Torun, Hakki M., Tang, Junyan, Paladhi, Pavel Roy, Zhang, Yanyan, Becker, Wiren D., Hejase, Jose A., Swaminathan, Madhavan
Published in 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (17.10.2021)
Published in 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (17.10.2021)
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Conference Proceeding
Signal Integrity Considerations of PCB Wiring in Tightly Pitched Module Pin Fields of High Speed Channels
Myers, Joshua C., Hejase, Jose A., Tang, Junyan, Chun, Sungjun, Becker, Wiren D., Dreps, Daniel M.
Published in 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (01.10.2019)
Published in 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (01.10.2019)
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Conference Proceeding
The IEEE EPS Packaging Benchmark Suite
Guo, Fei, Aygun, Kemal, Becker, W. Dale, Talocia, Stefano Grivet, Hejase, Jose A., Wong, Wui-Weng, Zhou, Tingdong, Barnes, Heidi, Peng, Zhen, Pelger, Alexander, Sahouli, Mohamed, Schutt-Aine, Jose, Ling, Feng, Griese, Elmar, Paladhi, Pavel Roy, Sharma, Rohit, Pham, Nam, Winkel, Thomas-Michael, Fledell, Evan, Hill, Michael J., Silva, Benjamin, Hu, Kaisheng, Aronsson, Jonatan, Liu, Chang, Jeong, Yiru, Yilmaz, Ali E.
Published in 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (17.10.2021)
Published in 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (17.10.2021)
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Conference Proceeding
An Approach For Tuning Signal Integrity Properties Of Edge Card Connectors With Conductive Fixture In High-Speed Link Channels
Zhang, Yanyan, Hejase, Jose A., Bohra, Mahesh, Paladhi, Pavel R., Shan, Lei, Chun, Sungjun, Audet, Jean J., Becker, Wiren D., Dreps, Daniel M.
Published in 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (01.10.2019)
Published in 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (01.10.2019)
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Conference Proceeding
A Multiple Angle Method for THz Time-Domain Material Characterization
Hejase, Jose A., Rothwell, Edward J., Chahal, Premjeet
Published in IEEE transactions on terahertz science and technology (01.09.2013)
Published in IEEE transactions on terahertz science and technology (01.09.2013)
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Journal Article
Vertical and Horizontal Transitions of Substrate Integrated Waveguides Within a Multi-Layered PCB for High Speed Signaling Applications
Myers, Joshua C., Hejase, Jose A., Tang, Junyan, Paladhi, Pavel R., Becker, Wiren D., Chun, Sungjun, Dreps, Daniel M.
Published in 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (01.10.2018)
Published in 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (01.10.2018)
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Conference Proceeding
Polynomial Chaos modeling for jitter estimation in high-speed links
Dolatsara, Majid Ahadi, Yu, Huan, Hejase, Jose Ale, Becker, Wiren Dale, Swaminathan, Madhavan
Published in 2018 IEEE International Test Conference (ITC) (01.10.2018)
Published in 2018 IEEE International Test Conference (ITC) (01.10.2018)
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Conference Proceeding
Terahertz packaging: Study of substrates for novel component designs
Hejase, Jose A, Paladhi, Pavel R, Chahal, Prem
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
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Conference Proceeding