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"Heier, Gerhard"
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"Heier, Gerhard"
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CARRIER FOR HOLDING SEMICONDUCTOR WAFERS DURING A DOUBLE-SIDE POLISHING OF THE SEMICONDUCTOR WAFERS
by
HEIER GERHARD
,
ROETTGER KLAUS
Year of Publication
26.08.2010
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METHOD FOR PRODUCING A SEMICONDUCTOR WAFER
by
HEIER GERHARD
,
HEILMAIER ALEXANDER
,
ROETTGER KLAUS
Year of Publication
09.03.2010
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Process for polishing silicon wafers
by
HEIER GERHARD
,
WENSKI GUIDO
,
ALTMANN THOMAS
,
WINKLER WOLFGANG
Year of Publication
28.03.2002
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Process for producing a semiconductor wafer with polished edge
by
THOMAS ALTMANN
,
HEIER GERHARD
,
WOLFGANG WINKLER
,
WENSKI GUIDO
Year of Publication
20.08.2001
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CARRIER FOR HOLDING SEMICONDUCTOR WAFERS DURING A DOUBLE-SIDE POLISHING OF THE SEMICONDUCTOR WAFERS
by
HEIER GERHARD
,
ROETTGER KLAUS
Year of Publication
29.09.2010
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Carrier For Holding Semiconductor Wafers During A Double-Side Polishing Of The Semiconductor Wafers
by
HEIER GERHARD
,
ROETTGER KLAUS
Year of Publication
19.08.2010
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Method for producing a semiconductor wafer
by
Roettger, Klaus
,
Heier
,
Gerhard
,
Heilmaier, Alexander
Year of Publication
14.08.2012
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Method for producing a semiconductor wafer
by
HEIER GERHARD
,
HEILMAIER ALEXANDER
,
ROETTGER KLAUS
Year of Publication
14.08.2012
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Verfahren zur herstellung einer halbleiterscheibe
by
HEILMAIER, ALEXANDER
,
HEIER
,
GERHARD
Year of Publication
21.06.2013
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METHOD FOR PRODUCING A SEMICONDUCTOR WAFER
by
HEIER GERHARD
,
HEILMAIER ALEXANDER
,
ROETTGER KLAUS
Year of Publication
30.03.2010
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METHOD OF MANUFACTURING SEMICONDUCTOR WAFER
by
HEIER GERHARD
,
HEILMAIER ALEXANDER
,
ROETTGER KLAUS
Year of Publication
11.03.2010
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METHOD FOR PRODUCING A SEMICONDUCTOR WAFER
by
HEIER GERHARD
,
HEILMAIER ALEXANDER
,
ROETTGER KLAUS
Year of Publication
04.03.2010
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Carrier for holding semiconductor wafers during a double-side polishing of the semiconductor wafers
by
ROETTGER, KLAUS
,
HEIER
,
GERHARD
Year of Publication
01.09.2010
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Runner disk for holding conductive disks during reciprocal polish, has recesses for supporting conductive disks and depressing openings for polishing agent supplying polish
by
ROETTGER, KLAUS
,
HEIER
,
GERHARD
Year of Publication
08.07.2010
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Method for machining a semiconductor wafer on both sides in a carrier, carrier, and a semiconductor wafer produced by the method
by
Schmolke, Ruediger
,
Buschhardt, Thomas
,
Heier
,
Gerhard
,
Wenski, Guido
Year of Publication
02.06.2009
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Method for machining a semiconductor wafer on both sides in a carrier, carrier, and a semiconductor wafer produced by the method
by
HEIER GERHARD
,
SCHMOLKE RUEDIGER
,
WENSKI GUIDO
,
BUSCHHARDT THOMAS
Year of Publication
02.06.2009
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CARRIER AND METHOD OF SIMULTANEOUSLY MACHINING WORK ON BOTH SIDES
by
HEIER GERHARD
,
WENSKI GUIDO
,
HOELKER GREGOR
Year of Publication
27.05.2004
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Carrier disc and process for simultaneous two sided processing of workpieces such as silicon wafers has smooth steel body with plastic coated openings
by
WENSKI, GUIDO
,
HEIER
,
GERHARD
,
HOELKER, GREGOR
Year of Publication
19.05.2004
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Method for machining a semiconductor wafer on bothsides in a carrier, carrier and a semiconductor w afer produced by the method
by
WENSKI, GUIDO
,
HEIER GERHARD
,
BUSCHHARDT THOMAS
,
SCHMOLKE, RUDIGER
Year of Publication
26.02.2007
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METHOD OF PROCESSING SEMICONDUCTOR WAFER, CARRIER, AND SEMICONDUCTOR WAFER
by
HEIER GERHARD
,
WENSKI GUIDO
,
BUSCHHARDT THOMAS
,
SCHMOLKE RUDIGER
Year of Publication
08.02.2007
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