Backside Thinning Process Development for High-Density TSV in a 3-Layer Integration
Bouis, Renan, Marchand, Jeremy, Andre, Agathe, Borel, Stephan, Dechamp, Jerome, Vignoud, Lionel, Valentin, Paul, Assous, Myriam, Hebras, Damien
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding
3-layer Fine Pitch Cu-Cu Hybrid Bonding Demonstrator With High Density TSV For Advanced CMOS Image Sensor Applications
Nicolas, Stephane, Suarez-Berru, Jerzy-Javier, Bresson, Nicolas, Socquet-Clerc, Carole, Assous, Myriam, Borel, Stephan, Velard, Remi, Dechamp, Jerome, Bouis, Renan, Roman, Antonio, Abadie, Karine, Hebras, Damien
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Get full text
Conference Proceeding