HTA corrosion resistant technology for free cooling
Yongzhan He, Guofeng Chen, Wei Wei, Qiujiang Liu, Jiajun Zhang, Tianyu Zhou, Pinyan Zhu, Yongzhong Zhu, Chao Liu, Ahuja, Nishi
Published in 2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) (01.03.2015)
Published in 2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) (01.03.2015)
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Conference Proceeding
Experimental Investigation on Single-phase Immersion Cooling Solution for Data Center Application
Zheng, Jianwu, Chen, Xiangwu, Cheng, Bing, He, Yongzhan, Tian, Wenbin, Zhong, Yipeng, Yu, Jiang, Zhang, Zhichao, He, Ying, Li, Yin, Zhang, Zhijie, Wu, Lihui, Ahuja, Nishi
Published in 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (28.05.2024)
Published in 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (28.05.2024)
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Conference Proceeding
High Power Density Rack Design Optimal for Hyper Scale Data Center Carbon Emission Reduction
Wu, Zhenghui, He, Yongzhan, Zheng, Jianwu, Cheng, Bing, Zhang, Jun, Wu, Min, Lv, Wenqing, He, Ying, Yue, Pengfei, Ahuja, Nishi, Qiao, Qing
Published in 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (30.05.2023)
Published in 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (30.05.2023)
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Conference Proceeding
A Novel Cost Efficient Cold Plate Liquid Cooling Solution for Data Center Deployment
Wu, Zhenghui, He, Yongzhan, Zheng, Jianwu, Cheng, Bing, Zhang, Jun, Lv, Wenqing, Wu, Min, He, Ying, Yue, Pengfei, Ahuja, Nishi, Qiao, Qing
Published in 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (30.05.2023)
Published in 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (30.05.2023)
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Conference Proceeding
Smart Server Crash Prediction in Cloud Service Data Center
Liu, Xingxing, He, Yongzhan, Liu, Hongmei, Zhang, Jiajun, Liu, Bin, Peng, Xiangyu, Xu, Jialiang, Zhang, Jun, Zhou, Alex, Sun, Paul, Zhu, Kunye, Nishi, Ahuja, Zhu, Dayi, Zhang, Ken
Published in 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.07.2020)
Published in 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.07.2020)
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Conference Proceeding
Disk Failure Early Warning Based on the Characteristics of Customized SMART
Zhao, Jian, He, Yongzhan, Liu, Hongmei, Zhang, Jiajun, Liu, Bin, Zhang, Jun, Lv, Wenqing, Zhou, Alex, Jiang, Feng, Liu, Jing, Nishi, Ahujia
Published in 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.07.2020)
Published in 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.07.2020)
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Conference Proceeding
Advanced Single-phase Passive Immersion Cooling Solution with Natural Convection for Outdoor Edge Servers
Guo, Liwen, Wu, Jiahong, Hsieh, I-Min, Huang, Cheng-Hua, Li, Bo, Jao, Chiming, Lin, Vinson, Yuan, Robert, Tan, Xianguang, Fan, Xiaojin, Wu, Zhenghui, Sheng, Yong, He, Yongzhan, Zhang, Jiajun, Zhang, Jun, Chen, Carrie, Xia, Yuyang, Lv, Wenqing, Wu, Min, Du, Chris, He, Candy, Zhang, Jonas, Ahuja, Nishi, Qiao, Qing
Published in 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (01.06.2021)
Published in 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (01.06.2021)
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Conference Proceeding