Theoretical comparison of the energy harvesting capability among various electrostatic mechanisms from structure aspect
Lee, Chengkuo, Lim, Ye Mei, Yang, Bin, Kotlanka, Rama Krishna, Heng, Chun-Huat, He, Johnny Han, Tang, Min, Xie, Jin, Feng, Hanhua
Published in Sensors and actuators. A. Physical. (01.11.2009)
Published in Sensors and actuators. A. Physical. (01.11.2009)
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Journal Article
Characterization of intermediate In/Ag layers of low temperature fluxless solder based wafer bonding for MEMS packaging
Lee, Chengkuo, Yu, Aibin, Yan, Liling, Wang, Haitao, He, Johnny Han, Zhang, Qing Xin, Lau, John H.
Published in Sensors and actuators. A. Physical. (31.08.2009)
Published in Sensors and actuators. A. Physical. (31.08.2009)
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Journal Article
A novel die to wafer (D2W) collective bonding method for MEMS and electronics heterogeneous 3D integration
Won Kyoung Choi, Premachandran, C S, Ling Xie, Siong Chiew Ong, He, Johnny Han, Guan Jie Yap, Aibin Yu
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
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Conference Proceeding
Design, process integration and characterization of wafer level vacuum packaging for MEMS resonator
Aibin Yu, Premachandran, C S, Nagarajan, Ranganathan, Choi Won Kyoung, Lam Quynh Trang, Kumar, Rakesh, Li Shiah Lim, Han, Johnny He, Yap Guan Jie, Damaruganath, Pinjala
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
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Conference Proceeding
Theoretical study of the output energy for various MEMS based electrostatic mechanisms
Ye Mei Lim, Bin Yang, Kotlanka, R.K., Chun Huat Heng, Jin Xie, Min Tang, He Han, J., Hanhua Feng, Chengkuo Lee
Published in 2008 IEEE International Conference on Sustainable Energy Technologies (01.11.2008)
Published in 2008 IEEE International Conference on Sustainable Energy Technologies (01.11.2008)
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Conference Proceeding