C4NP technology: Manufacturability, yields and reliability
Perfecto, Eric D., Hawken, David, Longworth, Hai P., Cox, Harry, Srivastava, Kamalesh, Oberson, Valerie, Shah, Jayshree, Garant, John
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
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Conference Proceeding
C4NP Lead Free Solder Bumping and 3D Micro Bumping
Busby, J., Dang, B., Gruber, P., Hawken, D., Shah, J., Weisman, R., Perfecto, E., Ruhmer, K., Buchwalter, S.
Published in 2008 IEEE/SEMI Advanced Semiconductor Manufacturing Conference (01.05.2008)
Published in 2008 IEEE/SEMI Advanced Semiconductor Manufacturing Conference (01.05.2008)
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Conference Proceeding
C4NP as a High-Volume Manufacturing Method for Fine-Pitch and Lead-Free FlipChip Solder Bumping
Laine, E., Ruhmer, K., Perfecto, E., Longworth, H., Hawken, D.
Published in 2006 1st Electronic Systemintegration Technology Conference (01.09.2006)
Published in 2006 1st Electronic Systemintegration Technology Conference (01.09.2006)
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Conference Proceeding
C4NP - data for fine pitch to CSP flip chip solder bumping
Laine, E., Ruhmer, K., Belanger, L., Turgeon, M., Perfecto, E., Longworth, H., Hawken, D.
Published in 2006 8th Electronics Packaging Technology Conference (01.12.2006)
Published in 2006 8th Electronics Packaging Technology Conference (01.12.2006)
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Conference Proceeding
C4NP - Lead Free Flip Chip Solder Bumping Manufacturing and Reliability Data
Laine, E., Ruhmer, K., Belanger, L., Turgeon, M., Perfecto, E., Longworth, H., Hawken, D.
Published in 2006 7th International Conference on Electronic Packaging Technology (01.08.2006)
Published in 2006 7th International Conference on Electronic Packaging Technology (01.08.2006)
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Conference Proceeding
Unique feature design enabling structural integrity for advanced low K semiconductor chips
Hawken, David, Davis, Charles, Jung, Dae, Landers, William, Questad, David
Year of Publication 23.10.2003
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Year of Publication 23.10.2003
Patent
UNIQUE FEATURE DESIGN ENABLING STRUCTURAL INTEGRITY FOR ADVANCED LOW K SEMICONDUCTOR CHIPS
Hawken, David, Davis, Charles, Jung, Dae, Landers, William, Questad, David
Year of Publication 21.08.2003
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Year of Publication 21.08.2003
Patent
Unique feature design enabling structural integrity for advanced low k semiconductor chips
Davis, Charles R, Hawken, David L, Jung, Dae Young, Landers, William F, Questad, David L
Year of Publication 09.11.2004
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Year of Publication 09.11.2004
Patent
Unique feature design enabling structural integrity for advanced low k semiconductor chips
JUNG DAE YOUNG, QUESTAD DAVID L, HAWKEN DAVID L, LANDERS WILLIAM F, DAVIS CHARLES R
Year of Publication 09.11.2004
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Year of Publication 09.11.2004
Patent
Unique feature design enabling structural integrity for advanced low K semiconductor chips
JUNG DAE YOUNG, QUESTAD DAVID L, HAWKEN DAVID L, LANDERS WILLIAM F, DAVIS CHARLES R
Year of Publication 18.11.2003
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Year of Publication 18.11.2003
Patent
Unique feature design enabling structural integrity for advanced low K semiconductor chips
Davis, Charles R, Hawken, David L, Jung, Dae Young, Landers, William F, Questad, David L
Year of Publication 18.11.2003
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Year of Publication 18.11.2003
Patent
Unique feature design enabling structural integrity for advanced low K semiconductor chips
JUNG DAE YOUNG, QUESTAD DAVID L, HAWKEN DAVID L, LANDERS WILLIAM F, DAVIS CHARLES R
Year of Publication 23.10.2003
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Year of Publication 23.10.2003
Patent
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING REINFORCING STRUCTURE OF SEMICONDUCTOR DEVICE
JUNG DAE YOUNG, QUESTAD DAVID L, HAWKEN DAVID L, WILLIAM F LANDERS, DAVIS CHARLES R
Year of Publication 29.08.2003
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Year of Publication 29.08.2003
Patent
UNIQUE FEATURE DESIGN ENABLING STRUCTURAL INTEGRITY FOR ADVANCED LOW K SEMICONDUCTOR CHIPS
JUNG DAE YOUNG, QUESTAD DAVID L, HAWKEN DAVID L, LANDERS WILLIAM F, DAVIS CHARLES R
Year of Publication 21.08.2003
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Year of Publication 21.08.2003
Patent