Bout-based Gas Source Localization using Aerial Robot Swarms
Hausler, Felix, Stuhrenberg, Jan, Smarsly, Kay, Neumann, Patrick P.
Published in 2023 IEEE SENSORS (29.10.2023)
Published in 2023 IEEE SENSORS (29.10.2023)
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Conference Proceeding
Digitally printed strain gauges on 3D metallic objects for pressure sensing
Roudenko, Jewgeni, Hausler, Felix, Franke, Jorg, Reichenberger, Marcus
Published in 2023 15th International Congress Mechatronic Integration Discourse (MID) (21.06.2023)
Published in 2023 15th International Congress Mechatronic Integration Discourse (MID) (21.06.2023)
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Conference Proceeding
Reliability of Piezojet-Printed Conductive Lines on Alumina Substrates Produced by Fused Filament Fabrication
Utsch, Daniel, Hausler, Felix, Sprenger, Mario, Zirn, Julian, Franke, Jorg
Published in 2023 15th International Congress Mechatronic Integration Discourse (MID) (21.06.2023)
Published in 2023 15th International Congress Mechatronic Integration Discourse (MID) (21.06.2023)
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Conference Proceeding
Optimizing Adhesion of Printed Conductive Lines on Additively Manufactured Ceramics
Utsch, Daniel, Hausler, Felix, Voigt, Christian, Sippel, Marcel, Franke, Jorg
Published in 2023 46th International Spring Seminar on Electronics Technology (ISSE) (10.05.2023)
Published in 2023 46th International Spring Seminar on Electronics Technology (ISSE) (10.05.2023)
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Conference Proceeding
Analysis of the Suitability of Inkjet-Printed Ag-Particle-Filled Inks for Use in Connections of Fine-Pitch Electrical Components
Voigt, Christian, Petersen, Matthias, Thielen, Nils, Utsch, Daniel, Hausler, Felix, Kirchberger, Manfred, Franke, Jorg
Published in 2023 46th International Spring Seminar on Electronics Technology (ISSE) (10.05.2023)
Published in 2023 46th International Spring Seminar on Electronics Technology (ISSE) (10.05.2023)
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Conference Proceeding
Additively Printed Heating Structure for Radome De-icing Application
Siah, Kok Siong, Ramaiya, Umang Bharatkumar, Hausler, Felix, Dorfler, Max, Utsch, Daniel, Voigt, Christian, Franke, Jorg, Erdogan, Huseyin
Published in 2024 47th International Spring Seminar on Electronics Technology (ISSE) (15.05.2024)
Published in 2024 47th International Spring Seminar on Electronics Technology (ISSE) (15.05.2024)
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Conference Proceeding
Solderability of Injection Moldable Thermoset Resins for Use in 3D Mechatronic Integrated Devices
Haussler, Felix, Petillon, Simon, Dornheim, Johannes, Weser, Sascha, Eberhardt, Wolfgang, Zimmermann, Andre, Franke, Jorg
Published in 2020 43rd International Spring Seminar on Electronics Technology (ISSE) (01.05.2020)
Published in 2020 43rd International Spring Seminar on Electronics Technology (ISSE) (01.05.2020)
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Conference Proceeding
Optimization of Ag-Ag Direct Bonding for Wafer-Level Power Electronics Packaging via Design of Experiments
Yu, Zechun, Wang, Shize, Letz, Sebastian, Bayer, Christoph Friedrich, Hausler, Felix, Schletz, Andreas, Suganuma, Katsuaki
Published in 2019 International Conference on Electronics Packaging (ICEP) (01.04.2019)
Published in 2019 International Conference on Electronics Packaging (ICEP) (01.04.2019)
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Conference Proceeding