Interfacial thermal resistance and temperature dependence of three adhesives for electronic packaging
Hasselman, D.P.H., Donaldson, K.Y., Barlow, F.D., Elshabini, A.A., Schiroky, G.H., Yaskoff, J.P., Dietz, R.L.
Published in IEEE transactions on components and packaging technologies (01.12.2000)
Published in IEEE transactions on components and packaging technologies (01.12.2000)
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Journal Article
Ion exchange at a metal–ceramic interface
Raj, R., Saha, A., An, Linan, Hasselman, D.P.H., Ernst, P.
Published in Acta materialia (14.03.2002)
Published in Acta materialia (14.03.2002)
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Journal Article
Determination of interfacial thermal resistivity by finite element modeling of the flash measurements
Bai, J.G., Zhiye Zhang, Calata, J.N., Guo-Quan Lu, Hasselman, D.P.H.
Published in The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543) (2004)
Published in The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543) (2004)
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Conference Proceeding
Comparison of the interfacial thermal resistivity of silver and solder die-attach using laser flash technique
Zhiye Zhang, Calata, J.N., Suchicital, C., Guo-Quan Lu, Hasselman, D.P.H.
Published in The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543) (2004)
Published in The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543) (2004)
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Conference Proceeding