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"Hassanzadeh, Nozar"
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"Hassanzadeh, Nozar"
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Optimized circuit design layout for high performance ball grid array packages
by
STEARNS WILLIAM P
,
HASSANZADEH NOZAR
Year of Publication
18.10.2011
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Optimized circuit design layout for high performance ball grid array packages
by
Stearns, William P
,
Hassanzadeh
,
Nozar
Year of Publication
18.10.2011
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Optimized circuit design layout for high performance ball grid array packages
by
STEARNS WILLIAM P
,
HASSANZADEH NOZAR
Year of Publication
03.11.2009
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Optimized circuit design layout for high performance ball grid array packages
by
Stearns, William P
,
Hassanzadeh
,
Nozar
Year of Publication
03.11.2009
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Patent
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Optimized Circuit Design Layout for High Performance Ball Grid Array Packages
by
STEARNS WILLIAM P
,
HASSANZADEH NOZAR
Year of Publication
02.07.2009
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Ball grid array package and method using enhanced power and ground distribution circuitry
by
STEARNS WILLIAM P
,
HASSANZADEH NOZAR
Year of Publication
05.11.2002
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Ball grid array package and method using enhanced power and ground distribution circuitry
by
Stearns, William P
,
Hassanzadeh
,
Nozar
Year of Publication
05.11.2002
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Optimized circuit design layout for high performance ball grid array packages
by
STEARNS WILLIAM P
,
HASSANZADEH NOZAR
Year of Publication
10.04.2001
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Ball grid array package and method using enhanced power and ground distribution circuitry
by
HASSANZADEH
;
NOZAR
,
STEARNS; WILLIAM P
Year of Publication
12.12.2000
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Ball grid array package
by
HASSANZADEH
;
NOZAR
,
KALIDAS; NAVINCHANDRA
,
LAMSON; MICHAEL A
Year of Publication
04.07.2000
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Ball grid array package having a deformable metal layer and method
by
HASSANZADEH
;
NOZAR
,
KALIDAS; NAVINCHANDRA
,
STEARNS; WILLIAM P
Year of Publication
20.04.1999
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Semiconductor package with offset die pad
by
JARMAN; HALL E
,
HASSANZADEH
;
NOZAR
,
STEARNS; WILLIAM P
Year of Publication
29.08.2000
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Semiconductor package with offset die pad and method for manufacturing same
by
HASSANZADEH
,
NOZAR
,
JARMAN, HALL E
,
STEARNS, WILLIAM P
Year of Publication
21.09.1999
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