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Löffler, Torsten, Siebert, Karsten J., Quast, Holger, Hasegawa, Noburu, Loata, Gabriel, Wipf, Robert, Hahn, Tobias, Thomson, Mark, Leonhardt, Rainer, Roskos, Hartmut G.
Published in Philosophical transactions of the Royal Society of London. Series A: Mathematical, physical, and engineering sciences (15.02.2004)
Published in Philosophical transactions of the Royal Society of London. Series A: Mathematical, physical, and engineering sciences (15.02.2004)
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Resin paste for wafer bonding
HASEGAWA YUJI,KIKUCHI NOBURU,EHANA SATORU,ODAKAWAYASUHISA,KAWASUMI MASAO,YAMAZAKI MITSUO
Year of Publication 18.04.2007
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Year of Publication 18.04.2007
Patent